Sample separating apparatus and method, and substrate manufacturing method

ABSTRACT

This invention is to provide a technique of separating bonded substrate stacks having porous layers at a high yield. A separating apparatus ( 100 ) has a pair of substrate holding portions ( 270, 280 ). A bonded substrate stack ( 50 ) is sandwiched from upper and lower sides and horizontally held by the substrate holding portions ( 270, 280 ) and rotated. A jet is ejected from a nozzle ( 260 ) and injected into the porous layer of the bonded substrate stack ( 50 ), thereby separating the bonded substrate stack ( 50 ) into two substrates at the porous layer. Another separating apparatus ( 5000 ) has a pair of substrate holding portions ( 270, 280 ), a nozzle ( 260 ) of rejecting a fluid to the porous layer of a bonded substrate stack ( 50 ), and an abrupt operation prevention mechanism ( 4000 ) for preventing the lower substrate holding portion ( 280 ) from abruptly moving downward but allowing it to moderately move when separating the bonded substrate stack ( 50 ).

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a sample separating apparatus andmethod, and a substrate manufacturing method and, more particularly, toa separating method and apparatus for separating a plate-like samplehaving a separation layer at the separation layer, and a substratemanufacturing method using the method and apparatus.

2. Description of the Related Art

A substrate (SOI substrate) having an SOI (Silicon On Insulator)structure is known as a substrate having a single-crystal Si layer on aninsulating layer. A device using this SOI substrate has many advantagesthat cannot be achieved by ordinary Si substrates. Examples of theadvantages are as follows.

(1) The integration degree can be increased because dielectric isolationis easy.

(2) The radiation resistance can be increased.

(3) The operating speed of the device can be increased because the straycapacitance is small.

(4) No well step is necessary.

(5) Latch-up can be prevented.

(6) A complete depletion type field effect transistor can be formed bythin film formation.

Since an SOI structure has the above various advantages, researches havebeen made on its formation method for several decades.

As one SOI technology, the SOS (Silicon On Sapphire) technology by whichSi is heteroepitaxially grown on a single-crystal sapphire substrate byCVD (Chemical Vapor Deposition) has been known for a long time. This SOStechnology once earned a reputation as the most matured SOI technology.However, the SOS technology has not been put into practical use to datebecause, e.g., a large amount of crystal defects are produced by latticemismatch in the interface between the Si layer and the underlyingsapphire substrate, aluminum that forms the sapphire substrate mixes inthe Si layer, the substrate is expensive, and it is difficult to obtaina large area.

Various SOI technologies have appeared next to the SOS technology. Forthese SOI technologies, various methods have been examined to reducecrystal defects or manufacturing cost. The methods include a method ofion-implanting oxygen into a substrate to form a buried oxide layer, amethod of bonding two wafers via an oxide film and polishing or etchingone wafer to leave a thin single-crystal Si layer on the oxide film, anda method of ion-implanting hydrogen to a predetermined depth from thesurface of an Si substrate having an oxide film, bonding the substrateto another substrate, leaving a thin single-crystal Si layer on theoxide film by heating or the like, and peeling one (the other substrate)of the bonded substrates.

The present applicant has disclosed a new SOI technology in JapanesePatent Laid-Open No. 5-21338. In this technology, a first substrateprepared by forming an unporous single-crystal layer (including asingle-crystal Si layer) on a single-crystal semiconductor substratehaving a porous layer is bonded to a second substrate via an insulatinglayer. After this, the substrates are separated at the porous layer,thereby transferring the unporous single-crystal layer to the secondsubstrate. This technique is advantageous because the film thicknessuniformity of the SOI layer is good, the crystal defect density in theSOI layer can be decreased, the surface planarity of the SOI layer isgood, no expensive manufacturing apparatus with special specificationsis required, and SOI substrates having about several hundred Å to 10-μmthick SOI films can be manufactured by a single manufacturing apparatus.

The present applicant has also disclosed a technique in Japanese PatentLaid-Open No. 7-302889, in which first and second substrates are bonded,the first substrate is separated from the second substrate without beingbroken, the surface of the separated first substrate is planarized, aporous layer is formed again, and the porous layer is reused. Since thefirst substrate is not wasted, this technique is advantageous in greatlyreducing the manufacturing cost and simplifying the manufacturingprocess.

In the above technique, when a substrate (to be referred to as a bondedsubstrate stack hereinafter) obtained by bonding two substrates is to beseparated at the porous layer, it is desired to separate the bondedsubstrate stack with good reproducibility without damaging thesubstrates.

SUMMARY OF THE INVENTION

The present invention has been made in consideration of the abovesituation, and has as its object to provide a technique for separatingplate-like samples such as bonded substrate stacks at a high yield.

According to the first aspect of the present invention, there isprovided a separating apparatus for separating a plate-like samplehaving a separation layer at the separation layer, characterized bycomprising a holding mechanism for holding the plate-like sample in asubstantially horizontal state while rotating the sample, and anejection portion for ejecting a fluid to the separation layer of theplate-like sample held by the holding mechanism to separate theplate-like sample at the separation layer by the fluid.

In the separating apparatus according to the first aspect of the presentinvention, the holding mechanism preferably comprises, e.g., a pair ofsample holding mechanisms for holding the plate-like sample bysandwiching the sample from upper and lower sides.

In the separating apparatus according to the first aspect of the presentinvention, the pair of holding mechanisms preferably have, e.g., chuckmechanisms for chucking the plate-like sample, respectively.

In the separating apparatus according to the first aspect of the presentinvention, preferably, the pair of holding mechanisms have, e.g., anapplication portion for applying a press force to the plate-like samplein an axial direction, and hold the plate-like sample to which the pressforce is being applied by the application portion.

In the separating apparatus according to the first aspect of the presentinvention, preferably, the pair of holding mechanisms have, e.g., anapplication portion for applying a force to the plate-like sample in anaxial direction, and hold the plate-like sample to which the force isbeing applied by the application portion.

In the separating apparatus according to the first aspect of the presentinvention, for example, the application portion preferably presses theplate-like, sample in the axial direction using a force of a spring.

In the separating apparatus according to the first aspect of the presentinvention, for example, the application portion preferably presses theplate-like sample in the axial direction using a force generated by acylinder.

In the separating apparatus according to the first aspect of the presentinvention, for example, the application portion preferably presses theplate-like sample in the axial direction using pressure of a fluid.

In the separating apparatus according to the first aspect of the presentinvention, for example, at least one of the pair of sample holdingmechanisms preferably comprises a Bernoulli chuck.

In the separating apparatus according to the first aspect of the presentinvention, preferably, for example, the application portion supplies afluid to a surface of the plate-like sample and applies the press forceto the plate-like sample using the fluid.

In the separating apparatus according to the first aspect of the presentinvention, the fluid supplied to the surface of the plate-like sample bythe application portion is preferably, e.g., a liquid.

In the separating apparatus according to the first aspect of the presentinvention, the fluid supplied to the plate-like sample by theapplication portion is preferably, e.g., a gas.

In the separating apparatus according to the first aspect of the presentinvention, preferably, for example, at least one of the pair of sampleholding mechanisms comprises a holding member that comes into contactwith the plate-like sample to hold the plate-like sample, and theapplication portion applies the press force to the plate-like sample viathe holding member.

In the separating apparatus according to the first aspect of the presentinvention, preferably, for example, the application portion presses theholding member using a fluid and applies the press force to theplate-like sample via the holding member.

In the separating apparatus according to the first aspect of the presentinvention, the fluid supplied to the holding member by the applicationportion is preferably, e.g., a liquid.

In the separating apparatus according to the first aspect of the presentinvention, the fluid supplied to the holding member by the applicationportion is preferably, e.g., a gas.

In the separating apparatus according to the first aspect of the presentinvention, for example, at least one of the pair of sample holdingmechanisms preferably comprises a holding member that comes into contactwith the plate-like sample to hold the plate-like sample and a Bernoullichuck for supporting the holding member.

In the separating apparatus according to the first aspect of the presentinvention, preferably, for example, the application portion presses theholding member using a magnetic force and applies the press force to theplate-like sample via the holding member.

In the separating apparatus according to the first aspect of the presentinvention, preferably, for example, the application portion applies thepress force to the plate-like sample from a lower sample holdingmechanism of the pair of sample holding mechanisms while fixing avertical position of an upper sample holding mechanism.

In the separating apparatus according to the first aspect of the presentinvention, preferably, for example, the application portion applies thepress force to the plate-like sample from an upper sample holdingmechanism of the pair of sample holding mechanisms while fixing avertical position of a lower sample holding mechanism.

In the separating apparatus according to the first aspect of the presentinvention, for example, the application portion preferably applies thepress force to the plate-like sample from both of the pair of sampleholding mechanisms.

In the separating apparatus according to the first aspect of the presentinvention, for example, the application portion preferably applies thepress force to the plate-like sample using a weight.

In the separating apparatus according to the first aspect of the presentinvention, for example, the application portion preferably changesstepwise the force for pressing the plate-like sample using a pluralityof weights.

In the separating apparatus according to the first aspect of the presentinvention, preferably, for example, the application portion presses theplate-like sample with a relatively small force when a portion near aperiphery of the plate-like sample is to be separated, and presses theplate-like sample with a relatively large force when a portion near thecenter of the plate-like sample is to be separated.

In the separating apparatus according to the first aspect of the presentinvention, preferably, for example, the application portion presses theplate-like sample with a relatively small force at a first step ofseparation of the plate-like sample, and presses the plate-like samplewith a relatively large force at a second step of separation of theplate-like sample.

In the separating apparatus according to the first aspect of the presentinvention, for example, the application portion preferably presses theportion near the center of the plate-like sample.

In the separating apparatus according to the first aspect of the presentinvention, preferably, for example, the application portion presses theplate-like sample with a relatively small force when a portion near aperiphery of the plate-like sample is to be separated, and presses theplate-like sample with a relatively large force when a portion near thecenter of the plate-like sample is to be separated.

In the separating apparatus according to the first aspect of the presentinvention, preferably, for example, the application portion presses theplate-like sample with a relatively small force at a first step ofseparation of the plate-like sample, and presses the plate-like samplewith a relatively large force at a second step of separation of theplate-like sample.

In the separating apparatus according to the first aspect of the presentinvention, for example, the application portion preferably presses theportion near the center of the plate-like sample.

In the separating apparatus according to the first aspect of the presentinvention, for example, the holding mechanism preferably has a structurecapable of transferring/receiving the plate-like sample to/from aconveyor mechanism for chucking a surface of the plate-like sample tohold the sample.

In the separating apparatus according to the first aspect of the presentinvention, for example, the holding mechanism preferably comprises aconvex support portion for holding the plate-like sample while forming agap between a predetermined portion of a surface of the plate-likesample and a predetermined portion of a surface of the holding member.

In the separating apparatus according to the first aspect of the presentinvention, for example, the holding mechanism preferably holds asubstantially central portion of the plate-like sample.

In the separating apparatus according to the first aspect of the presentinvention, for example, the holding mechanism preferably comprises asample holding mechanism for holding one surface of the plate-likesample.

In the separating apparatus according to the first aspect of the presentinvention, for example, the sample holding mechanism preferablycomprises a chuck mechanism for chucking the plate-like sample.

In the separating apparatus according to the first aspect of the presentinvention, for example, the chuck mechanism preferably chucks aplurality of portions of the plate-like sample.

In the separating apparatus according to the first aspect of the presentinvention, for example, the chuck mechanism preferably chucks aperipheral portion of the plate-like sample.

In the separating apparatus according to the first aspect of the presentinvention, for example, the chuck mechanism preferably chucks theplate-like sample to warp the plate-like sample.

In the separating apparatus according to the first aspect of the presentinvention, for example, the holding mechanism preferably has a structurecapable of exchanging the plate-like sample with a conveyor mechanismfor chucking a surface of the plate-like sample to hold the sample.

In the separating apparatus according to the first aspect of the presentinvention, for example, the sample holding mechanism preferablycomprises a convex support portion at a substantially central portion.

In the separating apparatus according to the first aspect of the presentinvention, preferably, for example, the chuck mechanism chucks theplate-like sample when a portion near a periphery of the plate-likesample is to be separated, and does not chuck the plate-like sample whena portion near the center of the plate-like sample is to be separated.

In the separating apparatus according to the first aspect of the presentinvention, preferably, for example, the chuck mechanism chucks theplate-like sample at a first step of separation of the plate-likesample, and does not chuck the plate-like sample at a second step ofseparation of the plate-like sample.

In the separating apparatus according to the first aspect of the presentinvention, for example, the holding mechanism preferably comprises anedge portion support member for supporting an edge portion of theplate-like sample.

In the separating apparatus according to the first aspect of the presentinvention, preferably, for example, the holding mechanism comprises aplurality of edge portion support members for supporting an edge portionof the plate-like sample and a rotation source for rotating at least oneof the plurality of edge portion support members, and the plate-likesample is rotated by transmitting a rotational force from the rotatededge portion support member to the plate-like sample.

In the separating apparatus according to the first aspect of the presentinvention, preferably, for example, the holding mechanism comprises atable for supporting the edge portion support member, and a rotationsource for rotating the table, and the plate-like sample is rotated byrotating the table.

In the separating apparatus according to the first aspect of the presentinvention, for example, the holding mechanism preferably furthercomprises a convex support portion for partially supporting a lowersurface of the plate-like sample.

In the separating apparatus according to the first aspect of the presentinvention, for example, the holding mechanism further preferablycomprises a convex support portion for partially supporting a lowersurface of the plate-like sample, the convex support portion beingrotated together with the plate-like sample placed on the supportportion.

Preferably, for example, the separating apparatus according to the firstaspect of the present invention further comprises a driving mechanismfor driving the edge portion support member toward the center or outerperiphery of the plate-like sample, and when the plate-like sample is tobe held, the edge portion support member is driven toward the center bythe driving mechanism.

In the separating apparatus according to the first aspect of the presentinvention, for example, each of the plurality of edge portion supportmembers preferably has a shape obtained by bonding bottom portions oftwo cones.

The separating apparatus according to the first aspect of the presentinvention preferably further comprises, e.g., a spacing mechanism for,after the plate-like sample is separated into two samples, spacing theseparated plate-like samples apart from each other.

In the separating apparatus according to the first aspect of the presentinvention, for example, the spacing mechanism preferably spaces theseparated plate-like samples apart substantially in the axial direction.

In the separating apparatus according to the first aspect of the presentinvention, for example, the spacing mechanism preferably spaces theseparated plate-like samples apart substantially in a planar direction.

The separating apparatus according to the first aspect of the presentinvention preferably further comprises, e.g., a cleaning portion forcleaning the plate-like sample which is being separated or the separatedplate-like samples.

According to the second aspect of the present invention, there isprovided a separating apparatus for separating a plate-like samplehaving a separation layer at the separation layer, characterized bycomprising a holding mechanism for holding the plate-like sample in asubstantially horizontal state while rotating the sample, and anejection portion for ejecting a fluid to the separation layer of theplate-like sample held by the holding mechanism to separate theplate-like sample at the separation layer by the fluid.

The separating apparatus according to the second aspect of the presentinvention preferably further comprises, e.g., a scanning portion forscanning the ejection portion or the plate-like sample in separating theplate-like sample.

The separating apparatus according to the second aspect of the presentinvention preferably further comprises, e.g., a pivot portion forpivoting the ejection portion about an axis parallel to an axis of theplate-like sample.

In the separating apparatus according to the first or second aspect ofthe present invention, the plate-like sample to be processed preferablyhas, e.g., a fragile layer as the separation layer.

In the separating apparatus according to the first or second aspect ofthe present invention, the fragile layer is preferably, e.g., a porouslayer.

In the separating apparatus according to the first or second aspect ofthe present invention, the fragile layer is preferably, e.g., amicrocavity layer.

In the separating apparatus according to the first or second aspect ofthe present invention, the plate-like sample to be processed ispreferably, e.g., a semiconductor substrate.

In the separating apparatus according to the first or second aspect ofthe present invention, the plate-like sample to be processed ispreferably formed by, e.g., bonding a first substrate and a secondsubstrate and has a fragile layer as the separation layer.

In the separating apparatus according to the first or second aspect ofthe present invention, the plate-like sample to be processed ispreferably formed by, e.g., forming a porous layer on a surface of afirst semiconductor substrate, forming an unporous layer on the porouslayer, and bonding a second substrate to the unporous layer.

According to the third aspect of the present invention, there isprovided a separating system characterized by comprising a separatingapparatus of the first or second aspect, and a conveyor robot fortransferring a plate-like sample to the separating apparatus in asubstantially horizontal state and receiving in the substantiallyhorizontal state plate-like samples separated by the separatingapparatus.

In the separating system according to the third aspect of the presentinvention, for example, the conveyor robot preferably transfers theplate-like sample while supporting the sample from a lower side to theseparating apparatus.

In the separating system according to the third aspect of the presentinvention, for example, the conveyor robot preferably receives a lowerplate-like sample of two separated plate-like samples from theseparating apparatus while supporting the sample from the lower side.

In the separating system according to the third aspect of the presentinvention, for example, the conveyor robot preferably receives an upperplate-like sample of the two separated plate-like samples from theseparating apparatus while supporting the sample from an upper side.

The separating system according to the third aspect of the presentinvention, preferably, for example, further comprises a centeringapparatus for aligning the center of the plate-like sample at apredetermined position, and the conveyor robot receives the plate-likesample from the centering apparatus and transfers the sample to theseparating apparatus.

The separating system according to the third aspect of the presentinvention, preferably, for example, further comprises a turningapparatus for rotating the plate-like sample through 180° to turn thesample, and the conveyor robot transfers the upper plate-like sample,separated by the separating apparatus, to the turning apparatus in thehorizontal state.

The separating system according to the third aspect of the presentinvention preferably further comprises, e.g., a cleaning/dryingapparatus for cleaning and drying the plate-like samples separated bythe separating apparatus.

According to the fourth aspect of the present invention, there isprovided a separating method of separating a plate-like sample having aseparation layer at the separation layer, characterized by comprisingthe steps of holding the plate-like sample by a holding mechanism in asubstantially horizontal state, ejecting a fluid from an electionportion to the separation layer of the plate-like sample while rotatingthe plate-like sample held by the holding mechanism to separate theplate-like sample at the separation layer using the fluid, and removingseparated plate-like samples from the holding mechanism.

According to the fifth aspect of the present invention, there isprovided a separating method of separating a plate-like sample having aseparation layer at the separation layer, characterized by comprisingthe steps of pressing and holding the plate-like sample by a holdingmechanism in a substantially horizontal state, ejecting a fluid from anelection portion to the separation layer of the plate-like sample heldby the holding mechanism to separate the plate-like sample at theseparation layer using the fluid, and removing separated plate-likesamples from the holding mechanism.

According to the sixth aspect of the present invention, there isprovided a separating method of separating a plate-like sample having aseparation layer at the separation layer, characterized by comprisingthe steps of transferring the plate-like sample to the above separatingapparatus in a horizontal state, separating the plate-like sample by theseparating apparatus, and receiving separated plate-like samples fromthe separating apparatus.

According to the seventh aspect of the present invention, there isprovided a separating method of separating a plate-like sample having aseparation layer at the separation layer, characterized by comprisingthe steps of transferring the plate-like sample to a centering apparatusin a horizontal state and aligning the center of the plate-like sampleat a predetermined position by the centering apparatus, receiving theplate-like sample from the centering apparatus and transferring theplate-like sample to the above separating apparatus in the horizontalstate to separate the plate-like sample by the separating apparatus, andreceiving separated plate-like samples from the separating apparatus.

According to the eighth aspect of the present invention, there isprovided a separating method of separating a plate-like sample having aseparation layer at the separation layer, characterized by comprisingthe steps of transferring the plate-like sample to a centering apparatusin a horizontal state and aligning the center of the plate-like sampleat a predetermined position by the centering apparatus, receiving theplate-like sample from the centering apparatus and transferring theplate-like sample to the above separating apparatus in the horizontalstate to separate the plate-like sample by the separating apparatus,receiving an upper substrate of two separated plate-like samples fromthe separating apparatus, transferring the substrate to a turningapparatus, and rotating the plate-like sample through 180° to turn thesubstrate by the turning apparatus, receiving the plate-like sample fromthe turning apparatus, and receiving a lower substrate of the twoseparated plate-like samples from the separating apparatus.

According to the ninth aspect of the present invention, there isprovided a separating method of separating a plate-like sample having aseparation layer at the separation layer, characterized by comprisingthe steps of transferring the plate-like sample to a centering apparatusin a horizontal state and aligning the center of the plate-like sampleat a predetermined position by the centering apparatus, receiving theplate-like sample from the centering apparatus and transferring theplate-like sample to the above separating apparatus in the horizontalstate to separate the plate-like sample by the separating apparatus,receiving an upper substrate of two separated plate-like samples fromthe separating apparatus, transferring the substrate to a turningapparatus, and rotating the plate-like sample through 180° to turn thesubstrate by the turning apparatus, receiving the plate-like sample fromthe turning apparatus, transferring the sample to a cleaning/dryingapparatus, and cleaning and drying the sample by the cleaning/dryingapparatus, and receiving a lower substrate of the two separatedplate-like samples from the separating apparatus, transferring thesubstrate to the cleaning/drying apparatus, and cleaning and drying thesubstrate by the cleaning/drying apparatus.

According to the 10th aspect of the present invention, there is provideda separating method of separating a plate-like sample having aseparation layer at the separation layer, characterized by comprisingthe steps of transferring the plate-like sample to the above separatingapparatus in the horizontal state to separate the plate-like sample bythe separating apparatus, receiving an upper substrate of two separatedplate-like samples from the separating apparatus, transferring thesubstrate to a turning apparatus, and rotating the plate-like samplethrough 180° to turn the substrate by the turning apparatus, receivingthe plate-like sample from the turning apparatus, and receiving a lowersubstrate of the two separated plate-like samples from the separatingapparatus.

According to the 11th aspect of the present invention, there is provideda separating method of separating a plate-like sample having aseparation layer at the separation layer, characterized by comprisingthe steps of transferring the plate-like sample to the above separatingapparatus in the horizontal state to separate the plate-like sample bythe separating apparatus, receiving an upper substrate of two separatedplate-like samples from the separating apparatus, transferring thesubstrate to a turning apparatus, and rotating the plate-like samplethrough 180° to turn the substrate by the turning apparatus, receivingthe plate-like sample from the turning apparatus, transferring thesample to a cleaning/drying apparatus, and cleaning and drying thesample by the cleaning/drying apparatus, and receiving a lower substrateof the two separated plate-like samples from the separating apparatus,transferring the substrate to the cleaning/drying apparatus, andcleaning and drying the substrate by the cleaning/drying apparatus.

According to the 12th aspect of the present invention, there is provideda separating method of separating a plate-like sample having aseparation layer at the separation layer, characterized by comprisingthe steps of transferring the plate-like sample to the above separatingapparatus in the horizontal state to separate the plate-like sample bythe separating apparatus, and transferring each of separated plate-likesamples to a cleaning/drying apparatus and cleaning and drying thesample by the cleaning/drying apparatus.

According to the 13th aspect of the present invention, there is provideda separating method of separating a plate-like sample having aseparation layer at the separation layer, characterized by comprisingthe step of ejecting a fluid to the separation layer of the plate-likesample while holding and rotating the plate-like sample in asubstantially horizontal state to separate the plate-like sample at theseparation layer using the fluid.

According to the 14th aspect of the present invention, there is provideda separating method of separating a plate-like sample having aseparation layer at the separation layer, characterized by comprisingthe step of ejecting a fluid to the separation layer of the plate-likesample while pressing and holding the plate-like sample in asubstantially horizontal state to separate the plate-like sample at theseparation layer using the fluid.

According to the 15th aspect of the present invention, there is provideda method of manufacturing a substrate, characterized by comprising thepreparation step of bonding a first substrate having a fragile layer toa second substrate to prepare a bonded substrate stack, the separationstep of separating the bonded substrate stack at the fragile layer usinga fluid, and the removal step of removing the fragile layer remaining onthe second substrate after the separation step, wherein the separationstep comprises ejecting the fluid to the fragile layer of the bondedsubstrate stack while holding and rotating the bonded substrate stack ina substantially horizontal state to separate the bonded substrate stackat the fragile layer using the fluid.

According to the 16th aspect of the present invention, there is provideda method of manufacturing a substrate, characterized by comprising thepreparation step of bonding a first substrate having a fragile layer toa second substrate to prepare a bonded substrate stack, the separationstep of separating the bonded substrate stack at the fragile layer usinga fluid, and the removal step of removing the fragile layer remaining onthe second substrate after the separation step, wherein the separationstep comprises ejecting the fluid to the fragile layer of the bondedsubstrate stack while pressing and holding the bonded substrate stack ina substantially horizontal state to separate the bonded substrate stackat the fragile layer using the fluid.

According to the 17th aspect of the present invention, there is provideda separating apparatus for separating a plate-like sample having aseparation layer at the separation layer, characterized by comprising aholding mechanism for holding the plate-like sample, an ejection portionfor ejecting a fluid to the plate-like sample held by the holdingmechanism to separate the plate-like sample at the separation layerusing the fluid, and an abrupt operation prevention mechanism forpreventing the holding mechanism from abruptly moving due to a force ofthe fluid acting in the plate-like sample while allowing the holdingmechanism to moderately move when separating the plate-like sample.

In the separating apparatus according to the 17th aspect of the presentinvention, the abrupt operation prevention mechanism preferablycomprises, e.g., a damper mechanism.

The separating apparatus according to the 17th aspect of the presentinvention preferably further comprises, e.g., a rotating mechanism forrotating the holding mechanism about an axis substantially perpendicularto a fluid ejection direction of the ejection portion when separatingthe plate-like sample.

In the separating apparatus according to the 17th aspect of the presentinvention, the abrupt operation prevention mechanism is preferably,e.g., coaxial with the a holding mechanism.

In the separating apparatus according to the 17th aspect of the presentinvention, preferably, for example, the holding mechanism comprises apair of sample holding portions for sandwiching and holding theplate-like sample, at least one of the pair of sample holding portionscan move in a direction substantially perpendicular to the fluidejection direction of the ejection portion, and the abrupt operationprevention mechanism prevents the movable sample holding portion fromabrupt movement while allowing the movable sample holding portion tomoderately move when separating the plate-like sample.

In the separating apparatus according to the 17th aspect of the presentinvention, for example, the abrupt operation prevention mechanismpreferably comprises a movable portion which moves in contact with themovable sample holding portion, and a reaction generation portion forgenerating a reaction against a force applied from the movable sampleholding portion to the movable portion.

In the separating apparatus according to the 17th aspect of the presentinvention, for example, the movable portion preferably smoothly moves.

In the separating apparatus according to the 17th aspect of the presentinvention, preferably, for example, the movable portion comprises apiston, the reaction generation portion comprises a frame memberconstructing a pressure chamber for causing pressure to act on thepiston, and the frame member has a channel for discharging a fluid fromthe pressure chamber.

In the separating apparatus according to the 17th aspect of the presentinvention, the abrupt operation prevention mechanism preferably has,e.g., a valve for controlling the fluid flowing through the channel.

In the separating apparatus according to the 17th aspect of the presentinvention, the abrupt operation prevention mechanism preferably furthercomprises, e.g., a restoring mechanism for extending the pistonretracted into the frame member and simultaneously filling the pressurechamber with the fluid when separating the plate-like sample.

In the separating apparatus according to the 17th aspect of the presentinvention, preferably, for example, the restoring mechanism has aspring, and the piston is extended by a force of the spring to fill thepressure chamber with the fluid.

In the separating apparatus according to the 17th aspect of the presentinvention, preferably, for example, the restoring mechanism comprises afilling mechanism for filing the pressure chamber with the fluid, andthe piston is extended by filling the pressure chamber with the fluid bythe filling mechanism.

In the separating apparatus according to the 17th aspect of the presentinvention, the holding mechanism preferably further comprises, e.g., apress mechanism for applying a press force to the plate-like sample in adirection substantially perpendicular to the fluid ejection direction ofthe ejection portion when holding the plate-like sample.

The separating apparatus according to the 17th aspect of the presentinvention, preferably, for example, further comprises a driving portionfor changing a position where the fluid ejected from the ejectionportion is injected into the plate-like sample, and the plate-likesample is separated while changing the position.

In the separating apparatus according to the 17th aspect of the presentinvention, the driving portion preferably comprises, e.g., a motor forrotating the plate-like sample about an axis substantially perpendicularto the fluid ejection direction of the ejection portion.

In the separating apparatus according to the 17th aspect of the presentinvention, the separation layer is preferably, e.g., a fragile layer.

In the separating apparatus according to the 17th aspect of the presentinvention, the fragile layer is preferably, e.g., a porous layer.

In the separating apparatus according to the 17th aspect of the presentinvention, the fragile layer is preferably, e.g., a microcavity layer.

In the separating apparatus according to the 17th aspect of the presentinvention, the plate-like sample to be separated is preferably, e.g., asemiconductor substrate.

In the separating apparatus according to the 17th aspect of the presentinvention, the plate-like sample to be separated is preferably formedby, e.g., bonding a first substrate and a second substrate.

According to the 18th aspect of the present invention, there is provideda separating method of ejecting a fluid to a separation layer of aplate-like sample having the separation layer to separate the plate-likesample at the separation layer, characterized by comprising the step ofseparating the plate-like sample while preventing the plate-like samplefrom abruptly warping due to a force of the fluid acting in theplate-like sample and allowing the plate-like sample to moderately warp.

In the separating method according to the 18th aspect of the presentinvention, the separation layer is preferably, e.g., a fragile layer.

In the separating method according to the 18th aspect of the presentinvention, the fragile layer is preferably, e.g., a porous layer.

In the separating method according to the 18th aspect of the presentinvention, the fragile layer is preferably, e.g., a microcavity layer.

In the separating method according to the 18th aspect of the presentinvention, the plate-like sample to be separated is preferably, e.g., asemiconductor substrate.

In the separating method according to the 18th aspect of the presentinvention, the plate-like sample to be separated is preferably formedby, e.g., bonding a first substrate and a second substrate.

According to the 19th aspect of the present invention, there is provideda method of manufacturing a substrate, characterized by comprising thepreparation step of bonding a first substrate having a fragile layer toa second substrate to prepare a bonded substrate stack, the separationstep of separating the bonded substrate stack at the fragile layer usinga fluid, and the removal step of removing the fragile layer remaining onthe second substrate after the separation step, wherein the separationstep comprises separating the bonded substrate stack at the fragilelayer while preventing the bonded substrate stack from abruptly warpingdue to a force of the fluid acting in the bonded substrate stack andallowing the bonded substrate stack to moderately warp.

Further objects, features and advantages of the present invention willbecome apparent from the following detailed description of theembodiments of the present invention with reference to the accompanyingdrawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A to 1E are sectional views for explaining the steps inmanufacturing an SOI substrate according to a preferred embodiment ofthe present invention;

FIG. 2 is a view showing the schematic arrangement of a separatingapparatus according to the first embodiment of the present invention;

FIG. 3 is a perspective view showing the schematic arrangement of asubstrate holding portion shown in FIG. 2;

FIG. 4 is a view showing the schematic arrangement of a separatingapparatus according to the second embodiment of the present invention;

FIG. 5 is a view showing the schematic arrangement of a separatingapparatus according to the third embodiment of the present invention;

FIG. 6 is a view showing the schematic arrangement of a separatingapparatus according to the fourth embodiment of the present invention;

FIG. 7 is a view showing the schematic arrangement of a separatingapparatus according to the fifth embodiment of the present invention;

FIG. 8 is a view showing the schematic arrangement of a separatingapparatus according to the sixth embodiment of the present invention;

FIG. 9 is a view showing the schematic arrangement of a separatingapparatus according to the seventh embodiment of the present invention;

FIG. 10 is a view showing the schematic arrangement of a separatingapparatus according to the eighth embodiment of the present invention;

FIG. 11 is a view showing the schematic arrangement of a separatingapparatus according to the ninth embodiment of the present invention;

FIG. 12 is a view showing the schematic arrangement of a separatingapparatus according to the 10th embodiment of the present invention;

FIG. 13 is a view showing the schematic arrangement of a separatingapparatus according to the 11th embodiment of the present invention;

FIG. 14 is a view showing the schematic arrangement of a separatingapparatus according to the 12th embodiment of the present invention;

FIG. 15 is a view showing the schematic arrangement of a separatingapparatus according to the 13th embodiment of the present invention;

FIG. 16 is a view showing the schematic arrangement of a separatingapparatus according to the 14th embodiment of the present invention;

FIG. 17 is a view showing the schematic arrangement of the separatingapparatus according to the 14th embodiment of the present invention;

FIG. 18 is a view showing the schematic arrangement of the separatingapparatus according to the 14th embodiment of the present invention;

FIG. 19 is a view showing the schematic arrangement of the separatingapparatus according to the 14th embodiment of the present invention;

FIG. 20 is a perspective view showing the schematic arrangement of anoperation section shown in FIGS. 16 to 19;

FIG. 21 is a view showing the schematic arrangement of a separatingapparatus according to the 15th embodiment of the present invention;

FIG. 22 is a view showing the schematic arrangement of a separatingapparatus according to the 16th embodiment of the present invention;

FIG. 23 is a view showing the schematic arrangement of the separatingapparatus according to the 16th embodiment of the present invention;

FIG. 24 is a view showing the schematic arrangement of the separatingapparatus according to the 16th embodiment of the present invention;

FIG. 25 is a view showing the schematic arrangement of a separatingapparatus according to the 17th embodiment of the present invention;

FIG. 26 is a view showing the schematic arrangement of the separatingapparatus according to the 17th embodiment of the present invention;

FIG. 27 is a view showing the schematic arrangement of a separatingapparatus according to the 18th embodiment of the present invention;

FIG. 28 is a view showing the schematic arrangement of a separatingapparatus according to the 19th embodiment of the present invention;

FIG. 29 is a view showing the schematic arrangement of the separatingapparatus according to the 19th embodiment of the present invention;

FIG. 30 is a view showing the schematic arrangement of a separatingapparatus according to the 20th embodiment of the present invention;

FIG. 31 is a view showing the schematic arrangement of a separatingapparatus according to the 22nd embodiment of the present invention;

FIG. 32 is a view showing the schematic arrangement of the separatingapparatus according to the 22nd embodiment of the present invention;

FIG. 33 is a view showing the schematic arrangement of a separatingapparatus according to the 23rd embodiment

FIG. 34 is a view showing the schematic arrangement of a separatingapparatus according to the 23rd embodiment of the present invention;

FIG. 35 is a view showing an example of various separating methods withan emphasis on the relationship between a bonded substrate stack and anozzle for ejecting a jet;

FIG. 36 is a view showing an example of various separating methods withan emphasis on the relationship between a bonded substrate stack and anozzle for ejecting a jet;

FIGS. 37A and 37B are views showing another example of variousseparating methods with an emphasis on the relationship between a bondedsubstrate stack and a nozzle for ejecting a jet;

FIG. 38 is a view showing still another example of various separatingmethods with an emphasis on the relationship between a bonded substratestack and a nozzle for ejecting a jet;

FIG. 39 is a plan view showing the schematic arrangement of a separatingsystem according to the 25th embodiment of the present invention;

FIG. 40 is a view showing the schematic arrangement of a separatingapparatus according to the 21st embodiment of the present invention;

FIG. 41 is a view showing the arrangement of an abrupt operationprevention mechanism using a damper mechanism;

FIG. 42 is a view showing the first modification of the abrupt operationprevention mechanism shown in FIG. 41; and

FIG. 43 is a view showing the second modification of the abruptoperation prevention mechanism shown in FIG. 41.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

Preferred embodiments of the present invention will be described belowwith reference to the accompanying drawings.

FIGS. 1A to 1E are sectional views for explaining steps in manufacturingan SOI substrate according a preferred embodiment of the presentinvention.

In the step shown in FIG. 1A, a single-crystal Si substrate 11 isprepared, and a porous Si layer 12 is formed on the surface of thesingle-crystal Si substrate 11 by, e.g., anodizing. In the step shown inFIG. 1B, an unporous single-crystal Si layer 13 is formed on the porousSi layer 12 by epitaxial growth. An insulating layer (e.g., an SiO₂layer) 15 is formed on the unporous single-crystal Si layer 13. Withthis process, a first substrate 10 is formed.

In the step shown in FIG. 1C, a second substrate 20 is prepared andbrought into tight contact with the first substrate 10 at roomtemperature while making the insulating layer 15 oppose the secondsubstrate 20. After this, the first substrate 10 and second substrate 20are bonded by anodic bonding, pressing, heating, or a combinationthereof. The insulating layer 15 and second substrate 20 are firmlybonded to form the bonded substrate stack 50. The insulating layer 15may be formed on the unporous single-crystal Si layer 13, as describedabove. Alternatively, the insulating layer 15 may be formed either onthe second substrate 20 or on both the unporous single-crystal Si layer13 and second substrate 20 as far as the state shown in FIG. 1C isobtained upon bringing the first and second substrates into tightcontact with each other.

In the step shown in FIG. 1D, the two bonded substrates are separated atthe porous Si layer 12. The second substrate side (10″+20) has amultilayered structure of porous Si layer 12″/single-crystal Si layer13/insulating layer 15/single-crystal Si substrate 20. The firstsubstrate side (10′) has a structure wherein a porous Si layer 12′ isformed on the single-crystal Si substrate 11.

After the remaining porous Si layer 12′ is removed, and the surface ofthe porous Si Layer 12′ is planarized as needed, the separated substrate(10′) is used as a single-crystal Si substrate 11 for forming a firstsubstrate (10) again.

After the bonded substrate stack is separated, in the step shown in FIG.1E, the porous layer 12″ on the surface on the second substrate side(10″+20) is selectively removed. With this process, a substrate having amultilayered structure of a single-crystal Si layer 13/insulating layer15/single-crystal Si substrate 20, i.e., an SOI structure is obtained.

As the second substrate, for example, not only a single-crystal Sisubstrate but also an insulating substrate (e.g., quartz substrate) or atransparent substrate (e.g., quartz substrate) can be used.

In this embodiment, to facilitate the process of bonding two substratesand separating them, a porous Si layer 12 having a fragile structure isformed in the separation region. In place of the porous layer, forexample, a microcavity layer may be formed. The microcavity layer can beformed by, e.g., implanting ions into a semiconductor substrate.

In this embodiment, for part of the step shown in FIG. 1D, i.e., thestep of separating the bonded substrate stack, a separating apparatuswhich ejects a liquid or gas (fluid) to the porous Si layer as theseparation layer to separate the bonded substrate stack into twosubstrates at the separation layer is used.

Basic Arrangement of Separating Apparatus

This separating apparatus uses the water jet method. Generally, thewater jet method ejects a high-speed, high-pressure stream of water toan object to, e.g., cut or process a ceramic, metal, concrete, resin,rubber, or wood, remove a coating film from the surface, or clean thesurface (“Water Jet”, Vol. 1, No. 1, page 4 (1984)).

This separating apparatus ejects a stream of fluid to the porous layer(separation region) as a fragile structure of a bonded substrate stackto selectively break the porous layer, thereby separating the substratestack at the porous layer. The stream will be referred to as a “jet”hereinafter. The fluid forming a jet will be referred to as a “jetmedium”. As the jet medium, it is possible to use water, an organicsolvent such as alcohol, an acid such as hydrofluoric acid or nitricacid, an alkali such as potassium hydroxide, a gas such as air, nitrogengas, carbonic acid gas, a rare gas, or an etching gas, or a plasma.

When this separating apparatus is applied to manufacture a semiconductordevice or separate, e.g., a bonded substrate stack, pure water withminimum impurity metals or particles is preferably used as the jetmedium.

The jet ejecting conditions can be determined in accordance with, e.g.,the type of separation region (e.g., a porous layer) or the shape of theside surfaces of the bonded substrate stack. As the jest ejectingconditions, for example, pressure to be applied to the jet medium, jetscanning speed, nozzle width or diameter (the diameter is substantiallythe same as the jet diameter), nozzle shape, distance between the nozzleand the separation region, and flow rate of the jet are used asimportant parameters.

According to the separating method using the water jet method, a bondedsubstrate stack can be separated into two substrates without damagingthe bonded substrate stack.

Each of separating apparatuses according to the preferred embodiments ofthe present invention holds a sample such as a bonded substrate stackwhile setting the sample surface substantially horizontally, and in thisstate, separates the sample at the fragile structure (e.g., a porouslayer). When the sample is held with its surface set horizontally, forexample, (1) the sample can be prevented from dropping, (2) the samplecan be easily held, (3) the sample can be easily conveyed, (4) thesample can be efficiently transferred between the separating apparatusand another apparatus, and (5) the projection area (occupation area) ofthe separating apparatus can be reduced because the constituent elementscan be disposed in the vertical direction.

Preferred embodiments of the present invention will be described below.The separating apparatuses according to the embodiments are suitable forseparating a bonded substrate stack having a porous layer or microcavitylayer as a fragile structure. The separating apparatuses are alsosuitable for separating another sample having a fragile structure. Thefollowing embodiments are particularly suitable for separating a samplehaving, as a separation region, a region more fragile than the remainingregions. For example, the separating apparatuses can be used to separatea sample having a uniform structure using an arbitrary portion as aseparation region. In the following description, however, the bondedsubstrate stack 50 as shown in FIG. 1C is used as the sample to beseparated, for the descriptive convenience.

First Embodiment

FIG. 2 is a view showing the schematic arrangement of a separatingapparatus according to the first embodiment of the present invention. Aseparating apparatus 100 has a pair of substrate holding portions 270and 280. The substrate holding portions 270 and 280 horizontally holdand rotate a bonded substrate stack 50 by sandwiching it from the upperand lower sides. A jet is ejected from a nozzle 260 and injected towardthe porous layer of the bonded substrate stack 50, thereby separatingthe bonded substrate stack 50 into two substrates at the porous layer.

The upper substrate holding portion 270 is coupled to one end of arotating shaft 140. The other end of the rotating shaft 140 is coupledto the rotating shaft of a motor 110 via a coupling 130. The motor 110and rotating shaft 140 may be coupled not via the coupling 130 but via,e.g., a belt or another mechanism. The motor 110 is fixed to a supportmember 120 fixed on an upper table 170. The motor is controlled by acontrol section.

A vacuum line 141 for vacuum-chucking the bonded substrate stack 50 onthe substrate holding portion 270 extends through the rotating shaft140. The vacuum line 141 is connected to an external vacuum line via aring 150. The external vacuum line has a solenoid valve (not shown). Thesolenoid valve is ON/OFF-controlled by the control section as needed.The substrate holding portion 270 has a suction hole 271 forvacuum-chucking the bonded substrate stack 50. The suction hole 271 isconnected to the vacuum line 141. The suction hole 271, vacuum line 141,and solenoid valve construct the vacuum chuck mechanism of the substrateholding portion 270. The rotating shaft 140 is supported by the uppertable 170 via a bearing 160.

The lower substrate holding portion 280 is coupled to one end of arotating shaft 180. A handle 220 is coupled to the other end of therotating shaft 180. This handle 220 is operated either manually or by adriving mechanism (not shown). A compression spring 200 for extendingthe substrate holding portion 280 upward is inserted between therotating shaft 180 and a support member 210 and attached to the rear endside of the rotating shaft 180. In separation processing, the bondedsubstrate stack 50 is held by a press force applied by the compressionspring 200.

A vacuum line 181 for vacuum-chucking the bonded substrate stack 50 onthe substrate holding portion 280 extends through the rotating shaft180. The vacuum line 181 is connected to an external vacuum line via aring 190. The external vacuum line has a solenoid valve (not shown) Thesolenoid valve is ON/OFF-controlled by the control section as needed.The substrate holding portion 280 has a suction hole 281 forvacuum-chucking the bonded substrate stack 50. The suction hole 281 isconnected to the vacuum line 181. The suction hole 281, vacuum line 181,and solenoid valve construct the vacuum chuck mechanism of the substrateholding portion 280. The rotating shaft 180 is supported by a lowertable 240 via a reciprocal/rotational guide 230.

The lower table 240 is supported by a plurality of leg members 310. Theupper table 170 is supported on the lower table 240.

The nozzle 260 is attached to, e.g., the lower table 240 via a supportmember (not shown). In the separating apparatus 100 of the firstembodiment, the position of the nozzle 260 is controlled with referenceto the position of the upper substrate holding portion 270. A shutter251 driven by a motor 250 is inserted between the nozzle 260 and thesubstrate holding portions 270 and 280. When the shutter 251 is open,and a jet is ejected from the nozzle 260, the jet can be injected intothe bonded substrate stack 50. When the shutter 251 is closed, jetinjection into the bonded substrate stack 50 can be stopped.

FIG. 3 is a perspective view showing the schematic arrangement of thesubstrate holding portion shown in FIG. 2. The substrate holdingportions 270 and 280 have, e.g., a symmetrical structure. The substrateholding portions 270 and 280 have, at their outer peripheral portions, aplurality of guide members 273 and 283 for preventing a bonded substratestack from causing a positional shift or projecting from the substrateholding portions during separation, respectively.

To make it possible for a robot hand 400 of a conveyor robot to transferthe bonded substrate stack 50 to the substrate holding portion 270 or280 while supporting the bonded substrate stack 50 from the lower sideor to chuck the back side surface, i.e., the opposite surface of theseparated surface, of each separated substrate and allow the robot hand400 to receive the substrates from the substrate holding portions 270and 280, for example, the plurality of guide members 273 and 283 arepreferably arranged at an appropriate interval such that the robot hand400 can enter/leave.

When the bonded substrate stack 50 supported from the lower side istransferred to the substrate holding portion 270 or 280, the bondedsubstrate stack 50 can be effectively prevented from dropping.

When the robot hand 400 receives the separated substrates from thesubstrate holding portions 270 and 280 while chucking the back sidesurfaces of the substrates, any contamination of the robot hand 400 ordrop of the substrate can be effectively prevented. The reason for thisis as follows. When the separated surface of a substrate is chucked,chips may stick to the robot hand 400, and the chucking force may weakenbecause of unevenness or chips on the separated surface. In addition,when the robot hand 400 receives the separated substrates from thesubstrate holding portions 270 and 280 while chucking the back sidesurfaces, the risk of damaging the substrates due to chips can bereduced.

The substrate holding portions 270 and 280 have convex support portions272 and 282 near their central portions, respectively. The supportportions 272 and 282 have shift prevention members 290 and 300 aroundthem, respectively. The shift prevention members 290 and 300 formedfrom, e.g., rubber or a resin prevent the bonded substrate stack 50 frommoving in the planar direction. With the shift prevention members 290and 300, the bonded substrate stack 50 can be held with a small pressforce.

Procedures of separation processing by the separating apparatus 100 willbe described below. First, the handle 220 is moved downward against theforce of the compression spring 200 to form an appropriate gap betweenthe substrate holding portions 270 and 280. In this state, the bondedsubstrate stack 50 is horizontally supported by the robot hand 400 fromthe lower side and inserted to a predetermined position between thesubstrate holding portions 270 and 280.

The handle 220 is released to cause the compression spring 200 to actand move the lower substrate holding portion 280 upward, thereby causingthe substrate holding portion 280 to press the bonded substrate stack50.

The motor 110 is actuated to transmit the rotational force to therotating shaft 140. The rotating shaft 140, substrate holding portion270, bonded substrate stack 50, substrate holding portion 280, androtating shaft 180 rotate integrally.

While keeping the shutter 251 closed, a pump (not shown) connected tothe nozzle 260 is actuated to feed a high-pressure jet medium (e.g.,water) to the nozzle 260. A high-pressure jet is ejected from the nozzle260. When the jet stabilizes, the shutter 251 is opened. The jet ejectedfrom the nozzle 260 is continuously injected into the porous layer ofthe bonded substrate stack 50 to start separating the bonded substratestack 50.

When separation of the bonded substrate stack 50 is ended, the shutter251 is closed, and the pump connected to the nozzle 260 is stopped tostop jet injection into the bonded substrate stack 50. The operation ofthe motor 110 is also stopped.

The vacuum chuck mechanisms of the substrate holding portions 270 and280 are actuated (solenoid valves are opened) to cause the substrateholding portion 270 to vacuum-chuck the upper separated substrate andthe substrate holding portion 280 to vacuum-chuck the lower separatedsubstrate.

The handle 220 is moved downward against the force of the compressionspring 200 and the surface tension between the two separated substratesto form a predetermined gap between the substrate holding portions 270and 280. The two separated substrates are spaced apart from each other.

The robot hand 400 is inserted between the substrate and the substrateholding portion 270. The robot hand 400 chucks the substrate. Afterthat, chuck by the vacuum chuck mechanism of the substrate holdingportion 270 is canceled. The substrate is transferred from the substrateholding portion 270 to the robot hand 400. The robot hand 400 conveysthe substrate to a predetermined position (e.g., a cassette).

The robot hand 400 is inserted between the substrate and the substrateholding portion 280. The robot hand 400 chucks the substrate. Afterthat, chuck by the vacuum chuck mechanism of the substrate holdingportion 280 is canceled. The substrate is transferred from the substrateholding portion 280 to the robot hand 400. The robot hand 400 conveysthe substrate to a predetermined position (e.g., a cassette). The twoseparated substrates may be received by the robot hand in the reverseorder or simultaneously received by two robot hands (not shown).

After the bonded substrate stack 50 is separated into two substrates,the jet medium is present between the two substrates. When the jetmedium is a liquid (e.g., water), the surface tension is considerablylarge. Hence, to space the two substrates apart from each other with asmall force, a jet is preferably supplied from the nozzle 260 to the gapbetween the two substrates. In this case, the jet from the nozzle 260 isstopped after the two substrates are spaced apart from each other.Instead, a mechanism for ejecting a jet used to space the two substratesapart from each other may be independently prepared.

Second Embodiment

FIG. 4 is a view showing the schematic arrangement of a separatingapparatus according to the second embodiment of the present invention.The same reference numerals as in other drawings substantially denotethe same constituent elements in FIG. 4.

A separating apparatus 500 of the second embodiment as an air cylinder320 as a driving mechanism for driving lower substrate holding portion280 in place of the compression spring 200 of the first embodiment (FIG.2) A rotating shaft 180 is coupled to the piston rod of the air cylinder320 via a coupling 330. The air cylinder 320 is controlled by a controlsection (not shown).

Procedures of separation processing by the separating apparatus 500 willbe described below. First, the air cylinder 320 retracts the piston rodto form an appropriate gap between substrate holding portions 270 and280. In this state, a bonded substrate stack 50 is horizontallysupported by a robot hand 400 from the lower side and inserted to apredetermined position between the substrate holding portions 270 and280.

The air cylinder 320 extends the piston rod to move the lower substrateholding portion 280 upward. The substrate holding portion 280 pressesand holds the bonded substrate stack 50.

A motor 110 is actuated to transmit the rotational force to a rotatingshaft 140. The rotating shaft 140, substrate holding portion 270, bondedsubstrate stack 50, substrate holding portion 280, and rotating shaft180 rotate integrally.

While keeping a shutter 251 closed, a pump (not shown) connected to anozzle 260 is actuated to feed a high-pressure jet medium (e.g., water)to the nozzle 2,60. A high-pressure jet is ejected from the nozzle 260.When the jet stabilizes, the shutter 251 is opened. The jet ejected fromthe nozzle 260 is continuously injected into the porous layer of thebonded substrate stack 50 to start separating the bonded substrate stack50.

When separation of the bonded substrate stack 50 is ended, the shutter251 is closed, and the pump connected to the nozzle 260 is stopped tostop jet injection into the bonded substrate stack 50. The operation ofthe motor 110 is also stopped.

The vacuum chuck mechanisms of the substrate holding portions 270 and280 are actuated (solenoid valves are opened) to cause the substrateholding portion 270 to vacuum-chuck the upper separated substrate andthe substrate holding portion 280 to vacuum-chuck the lower separatedsubstrate.

The air cylinder 320 retracts the piston rod to form a predetermined gapbetween the substrate holding portions 270 and 280. The two separatedsubstrates are spaced apart from each other.

The robot hand 400 is inserted between the substrate and the substrateholding portion 270. The robot hand 400 chucks the substrate. Afterthat, chuck by the vacuum chuck mechanism of the substrate holdingportion 270 is canceled.

The substrate is transferred from the substrate holding portion 270 tothe robot hand 400. The robot hand 400 conveys the substrate to apredetermined position (e.g., a cassette).

The robot hand 400 is inserted between the substrate and the substrateholding portion 280. The robot hand 400 chucks the substrate. Afterthat, chuck by the vacuum chuck mechanism of the substrate holdingportion 280 is canceled. The substrate is transferred from the substrateholding portion 280 to the robot hand 400. The robot hand 400 conveysthe substrate to a predetermined position (e.g., a cassette). The twoseparated substrates may be received by the robot hand in the reverseorder or simultaneously received by two robot hands (not shown).

After the bonded substrate stack 50 is separated into two substrates,the jet medium is present between the two substrates. When the jetmedium is a liquid (e.g., water), the surface tension is considerablylarge. Hence, to space the two substrates apart from each other with asmall force, a jet is preferably supplied from the nozzle 260 to the gapbetween the two substrates. In this case, the jet from the nozzle 260 isstopped after the two substrates are spaced apart from each other.Instead, a mechanism for ejecting a jet used to space the two substratesapart from each other may be independently prepared.

Third Embodiment

FIG. 5 is a view showing the schematic arrangement of a separatingapparatus according to the third embodiment of the present invention.The same reference numerals as in other drawings substantially denotethe same constituent elements in FIG. 5.

A separating apparatus 600 holds a bonded substrate stack 50 by pressureof a fluid during separation. This separating apparatus 600 has a pairof substrate holding portions 270 and 610 for holding the bondedsubstrate stack 50. The upper substrate holding portion 270 andconstituent elements thereof are the same as those described above.

The lower substrate holding portion 610 is coupled to one end of anelevating shaft 620. The substrate holding portion 610 has a fluid blowportion 611 for causing pressure of a fluid to act on the bondedsubstrate stack 50 to press and hold the bonded substrate stack 50. Thisblow portion 611 is connected to an external pressure line via apressure line 622 in the elevating shaft 620. The external pressure linehas a solenoid valve (not shown). The solenoid valve isON/OFF-controlled by a control section as needed. The elevating shaft620 is supported by a lower table 240 via a reciprocal guide 631.

The lower substrate holding portion 610 has a suction hole 612 forvacuum-chucking the bonded substrate stack 50. The suction hole 612 isconnected to an external vacuum line via a vacuum line 621 in theelevating shaft 620. The external vacuum line has a solenoid valve (notshown). The solenoid valve is ON/OFF-controlled by the control sectionas needed.

The lower substrate holding portion 610 has, at its outer peripheralportion, a plurality of guide members for preventing a bonded substratestack from causing a positional shift or projecting from the substrateholding portions during separation, like the substrate holding portionshown in FIG. 3. The guide members are preferably arranged such that therobot hand can be inserted between a substrate and the substrate holdingportion 610, like the above-described guide members 283 (273).

With this above arrangement, when the bonded substrate stack 50 ispressed and held by pressure of a fluid during separation processing, analready separated portion of the bonded substrate stack 50 is allowed towarp due to the pressure of the jet medium injected into the bondedsubstrate stack 50. In addition, the warp amount can be appropriatelylimited. The fluid used to hold the bonded substrate stack 50 may be agas such as air or a liquid such as water.

The elevating shaft 620 is coupled to the piston rod of an air cylinder320 via a coupling 330. Vertical movement of the elevating shaft 620 iscontrolled by the air cylinder 320. In place of the air cylinder 320,another driving mechanism (e.g., a spring) may be employed.

Procedures of separation processing by the separating apparatus 600 willbe described below. First, the air cylinder 320 retracts the piston rodto form an appropriate gap between substrate holding portions 270 and610. In this state, the bonded substrate stack 50 is horizontallysupported by a robot hand 400 from the lower side, inserted to apredetermined position between the substrate holding portions 270 and610, and placed on the substrate holding portion 610.

The air cylinder 320 extends the piston rod to move the lower substrateholding portion 610 upward until a predetermined gap is formed betweenthe upper surface of the bonded substrate stack 50 and the supportportion of the upper substrate holding portion 270.

The solenoid valve of the external pressure line is opened to blow afluid from the blow portion 611 of the substrate holding portion 610.The bonded substrate stack 50 is floated, pressed against the uppersubstrate holding portion 270, and held.

A motor 110 is actuated to transmit the rotational force to a rotatingshaft 140. The rotating shaft 140, substrate holding portion 270, andbonded substrate stack 50 rotate integrally.

While keeping a shutter 251 closed, a pump (not shown) connected to anozzle 260 is actuated to feed a high-pressure jet medium (e.g., water)to the nozzle 260. A high-pressure jet is ejected from the nozzle 260.When the jet stabilizes, the shutter 251 is opened. The jet ejected fromthe nozzle 260 is continuously injected into the porous layer of thebonded substrate stack 50 to start separating the bonded substrate stack50.

When separation of the bonded substrate stack 50 is ended, the shutter251 is closed, and the pump connected to the nozzle 260 is stopped tostop jet injection into the bonded substrate stack 50. The operation ofthe motor 110 is also stopped.

The vacuum chuck mechanisms of the substrate holding portions 270 and610 are actuated (solenoid valves are opened) to cause the substrateholding portion 270 to vacuum-chuck the upper separated substrate andthe substrate holding portion 610 to vacuum-chuck the lower separatedsubstrate.

The air cylinder 320 retracts the piston rod to form a predetermined gapbetween the substrate holding portions 270 and 610. The two separatedsubstrates are spaced apart from each other.

The robot hand 400 is inserted between the substrate and the substrateholding portion 270. The robot hand 400 chucks the substrate. Afterthat, chuck by the vacuum chuck mechanism of the substrate holdingportion 270 is canceled.

The substrate is transferred from the substrate holding portion 270 tothe robot hand 400. The robot hand 400 conveys the substrate to apredetermined position (e.g., a cassette).

The robot hand 400 is inserted between the substrate and the substrateholding portion 610. The robot hand 400 chucks the substrate. Afterthat, chuck by the vacuum chuck mechanism of the substrate holdingportion 610 is canceled. The substrate is transferred from the substrateholding portion 610 to the robot hand 400. The robot hand 400 conveysthe substrate to a predetermined position (e.g., a cassette). The twoseparated substrates may be received by the robot hand in the reverseorder or simultaneously received by two robot hands (not shown).

After the bonded substrate stack 50 is separated into two substrates,the jet medium is present between the two substrates. When the jetmedium is a liquid (e.g., water), the surface tension is considerablylarge. Hence, to space the two substrates apart from each other with asmall force, a jet is preferably supplied from the nozzle 260 to the gapbetween the two substrates. In this case, the jet from the nozzle 260 isstopped after the two substrates are spaced apart from each other.Instead, a mechanism for ejecting a jet used to space the two substratesapart from each other may be independently prepared.

Fourth Embodiment

FIG. 6 is a view showing the schematic arrangement of a separatingapparatus according to the fourth embodiment of the present invention.The same reference numerals as in other drawings substantially denotethe same constituent elements in FIG. 6.

A separating apparatus 700 of the fourth embodiment roughly has anupside-down arrangement of the separating apparatus 600 of the thirdembodiment. More specifically, the separating apparatus 700 has a pairof substrate holding portions 710 and 280. The substrate holdingportions 710 and 280 horizontally hold a bonded substrate stack 50 bysandwiching it from the upper and lower sides. A jet is ejected from anozzle 260 and injected to a portion near the porous layer of the bondedsubstrate stack 50 to separate it into two substrates at the porouslayer.

The upper substrate holding portion 710 is coupled to one end of anelevating shaft 720. The substrate holding portion 710 causes pressureof a fluid to act on the bonded substrate stack 50 and holds the bondedsubstrate stack 50 by the pressure of the fluid.

The upper substrate holding portion 710 is coupled to one end of theelevating shaft 720. The substrate holding portion 710 has a fluid blowportion 711 for causing pressure of a fluid to act on the bondedsubstrate stack 50 to press and hold the bonded substrate stack 50. Thisblow portion 711 is connected to an external pressure line via apressure line 722 in the elevating shaft 720. The external pressure linehas a solenoid valve (not shown). The solenoid valve isON/OFF-controlled by a control section as needed. The elevating shaft720 is supported by an upper table 170 via a reciprocal guide 723.

The substrate holding portion 710 has a suction hole 712 forvacuum-chucking the bonded substrate stack 50. This suction hole isconnected to an external vacuum line via a vacuum line 721 in theelevating shaft 720. The external vacuum line has a solenoid valve (notshown). The solenoid valve is ON/OFF-controlled by the control section(not shown) as needed.

The upper substrate holding portion 710 has, at its outer peripheralportion, a plurality of guide members, for preventing a bonded substratestack from causing a positional shift or projecting from the substrateholding portions during separation, like the substrate holding portionshown in FIG. 3. The guide members are preferably arranged such that therobot hand can be inserted between a substrate and the substrate holdingportion 710, like the above-described guide members 283 (273).

With this above arrangement, when the bonded substrate stack 50 ispressed and held by pressure of a fluid during separation processing, analready separated portion of the bonded substrate stack 50 is allowed towarp due to the pressure of the jet medium injected into the bondedsubstrate stack 50. In addition, the warp amount can be appropriatelylimited. The fluid used to hold the bonded substrate stack 50 may be agas such as air or a liquid such as water.

The other end of the elevating shaft 720 is coupled to the piston rod ofan air cylinder 740 via a coupling 730. The air cylinder 740 is fixed tothe upper table 170.

The lower substrate holding portion 280 is coupled to one end of arotating shaft 750. The other end of the rotating shaft 750 is coupledto a motor 790 via a coupling 770. The rotating shaft 750 is supportedby a lower table 240 via a bearing 230. The motor 790 is fixed to asupport member 780 fixed to the lower table 240.

A vacuum line 751 connected to a suction hole 281 of the substrateholding portion 280 extends through the rotating shaft 750. The vacuumline 751 is connected to an external vacuum line via a ring 760. Theexternal vacuum line has a solenoid valve (not shown). The solenoidvalve is ON/OFF-controlled by the control section (not shown) as needed.

Procedures of separation processing by the separating apparatus 700 willbe described below. First, the air cylinder 740 retracts the piston rodto form an appropriate gap between substrate holding portions 710 and280. In this state, the bonded substrate stack 50 is horizontallysupported by a robot hand 400 from the lower side, inserted to apredetermined position between the substrate holding portions 710 and280, and placed on the substrate holding portion 280.

The air cylinder 740 extends the piston rod to move the upper substrateholding portion 710 downward until a predetermined gap is formed betweenthe upper surface of the bonded substrate stack 50 and the supportportion of the upper substrate holding portion 710.

The solenoid valve of the external pressure line is opened to blow afluid from the blow portion 711 of the substrate holding portion 710.The bonded substrate stack 50 is pressed against the lower substrateholding portion 280 and held.

The motor 790 is actuated to transmit the rotational force to therotating shaft 750. The rotating shaft 750, substrate holding portion280, and bonded substrate stack 50 rotate integrally.

While keeping a shutter 251 closed, a pump (not shown) connected to thenozzle 260 is actuated to feed a high-pressure jet medium (e.g., water)to the nozzle 260. A high-pressure jet is ejected from the nozzle 260.When the jet stabilizes, the shutter 251 is opened. The jet ejected fromthe nozzle 260 is continuously injected,into the porous layer of thebonded substrate stack 50 to start separating the bonded substrate stack50.

When separation of the bonded substrate stack,50 is ended, the shutter251 is closed, and the pump connected to the nozzle 260 is stopped tostop jet injection into the bonded substrate stack 50. The operation ofthe motor 790 is also stopped.

The vacuum chuck mechanisms of the substrate holding portions 710 and280 are actuated. (solenoid valves are opened) to cause the substrateholding portion 710 to vacuum-chuck the upper separated substrate andthe substrate holding portion 280 to vacuum-chuck the lower separatedsubstrate.

The air cylinder 740 retracts the piston rod to form a predetermined gapbetween the substrate holding portions 710 and 280. The two separatedsubstrates are spaced apart from each other.

The robot hand 400 is inserted between the substrate and the substrateholding portion 710. The robot hand 400 chucks the substrate. Afterthat, chuck by the vacuum chuck mechanism of the substrate holdingportion 710 is canceled. The substrate is transferred from the substrateholding portion 710 to the robot hand 400. The robot hand 400 conveysthe substrate to a predetermined position (e.g., a cassette).

The robot hand 400 is inserted between the substrate and the substrateholding portion 280. The robot hand 400 chucks the substrate. Afterthat, chuck by the vacuum chuck mechanism of the substrate holdingportion 280 is canceled.

The substrate is transferred from the substrate holding portion 280 tothe robot hand 400. The robot hand 400 conveys the substrate to apredetermined position (e.g., a cassette). The two separated substratesmay be received by the robot hand in the reverse order or simultaneouslyreceived by two robot hands (not shown).

After the bonded substrate stack 50 is separated into two substrates,the jet medium is present between the two substrates. When the jetmedium is a liquid (e.g., water), the surface tension is considerablylarge. Hence, to space the two substrates apart from each other with asmall force, a jet is preferably supplied from the nozzle 260 to the gapbetween the two substrates. In this case, the jet from the nozzle 260 isstopped after the two substrates are spaced apart from each other.Instead, a mechanism for ejecting a jet used to space the two substratesapart from each other may be independently prepared.

Fifth Embodiment

FIG. 7 is a view showing the schematic arrangement of a separatingapparatus according to the fifth embodiment of the present invention.The same reference numerals as in other drawings substantially denotethe same constituent elements in FIG. 7.

A separating apparatus 800 holds a bonded substrate stack 50 by pressureof a fluid during separation. The separating apparatus 800 has a pair ofsubstrate holding portions 270 and 810 for holding the bonded substratestack 50. The upper substrate holding portion 270 and constituentelements thereof are the same as those described above.

The lower substrate holding portion 810 is coupled to one end of anelevating shaft 820. The other end of the elevating shaft 820 is coupledto the piston rod of an air cylinder 320 via a coupling 330. Theelevating shaft 820 is supported by a lower table 240 via a reciprocalguide 824.

The lower substrate holding portion 810 has a fluid blow portion 812 forcausing pressure of a fluid to act on the bonded substrate stack 50 topress and hold the bonded substrate stack 50. This blow portion 812 isconnected to an external pressure line. The external pressure line has asolenoid valve (not shown). The solenoid valve is ON/OFF-controlled by acontrol section as needed.

The lower substrate holding portion 810 has a discharge line 811 forexternally discharging the fluid blown from the blow portion 812. Thelower substrate holding portion 810 also has a suction hole 814 forvacuum-chucking the bonded substrate stack 50. The suction hole 814 hasa solenoid valve 813 near its inlet to prevent the fluid blown from theblow portion 812 from being drawn from the suction hole 814. The suctionhole 814 is connected to a vacuum line 815 in the elevating shaft 820via the solenoid valve 813. The suction hole 814, solenoid valve 813,and vacuum line 815 construct the vacuum chuck mechanism of thesubstrate holding portion 810.

The lower substrate holding portion 810 has, at its outer peripheralportion, a plurality of guide members for preventing a bonded substratestack from causing a positional shift or projecting from the substrateholding portions during separation, like the substrate holding portionshown in FIG. 3. The guide members are preferably arranged such that therobot hand can be inserted between a substrate and the substrate holdingportion 810, like the above-described guide members 283 (273).

With this above arrangement, when the bonded substrate stack 50 ispressed and held by pressure of a fluid during separation processing, analready separated portion of the bonded substrate stack 50 is allowed towarp due to the pressure of the jet medium injected into the bondedsubstrate stack 50. In addition, the warp amount can be appropriatelylimited. The fluid used to hold the bonded substrate stack 50 may be agas such as air or a liquid such as water.

Procedures of separation processing by the separating apparatus 800 willbe described below. First, the air cylinder 320 retracts the piston rodto form an appropriate gap between substrate holding portions 270 and810. In this state, the bonded substrate stack 50 is horizontallysupported by a robot hand 400 from the lower side, inserted to apredetermined position between the substrate holding portions 270 and810, and placed on the substrate holding portion 810.

The air cylinder 320 extends the piston rod to move the lower substrateholding portion 810 upward until a predetermined gap is formed betweenthe upper surface of the bonded substrate stack 50 and the supportportion of the upper substrate holding portion 270.

The solenoid valve of the external pressure line is opened to blow afluid from the blow portion 812 of the substrate holding portion 810.The bonded substrate stack 50 is floated, pressed against the uppersubstrate holding portion 270, and held.

A motor 110 is actuated to transmit the rotational force to a rotatingshaft 140. The rotating shaft 140, substrate holding portion 270, andbonded substrate stack 50 rotate integrally.

While keeping a shutter 251 closed, a pump (not shown) connected to anozzle 260 is actuated to feed a high-pressure jet medium (e.g., water)to the nozzle 260. A high-pressure jet is ejected from the nozzle 260.When the jet stabilizes, the shutter 251 is opened. The jet ejected fromthe nozzle 260 is continuously injected into the porous layer of thebonded substrate stack 50 to start separating the bonded substrate stack50.

When separation of the bonded substrate stack 50 is ended, the shutter251 is closed, and the pump connected to the nozzle 260 is stopped tostop jet injection into the bonded substrate stack 50. The operation ofthe motor 110 is also stopped.

The vacuum chuck mechanisms of the substrate holding portions 270 and810 are actuated (solenoid valves are opened) to cause the substrateholding portion 270 to vacuum-chuck the upper separated substrate andthe substrate holding portion 810 to vacuum-chuck the lower separatedsubstrate.

The air cylinder 320 retracts the piston rod to form a predetermined gapbetween the substrate holding portions 270 and 810. The two separatedsubstrates are spaced apart from each other.

The robot hand 400 is inserted between the substrate and the substrateholding portion 270. The robot hand 400 chucks the substrate. Afterthat, chuck by the vacuum chuck mechanism of the substrate holdingportion 270 is canceled. The substrate is transferred from the substrateholding portion 270 to the robot hand 400. The robot hand 400 conveysthe substrate to a predetermined position (e.g., a cassette).

The robot hand 400 is inserted between the substrate and the substrateholding portion 810. The robot hand 400 chucks the substrate. Afterthat, chuck by the vacuum chuck mechanism of the substrate holdingportion 810 is canceled. The substrate is transferred from the substrateholding portion 810 to the robot hand 400. The robot hand 400 conveysthe substrate to a predetermined position (e.g., a cassette). The twoseparated substrates may be received by the robot hand in the reverseorder or simultaneously received by two robot hands (not shown).

After the bonded substrate stack 50 is separated into two substrates,the jet medium is present between the two substrates. When the jetmedium is a liquid (e.g., water), the surface tension is considerablylarge. Hence, to space the two substrates apart from each other with asmall force, a jet is preferably supplied from the nozzle 260 to the gapbetween the two substrates. In this case, the jet from the nozzle 260 isstopped after the two substrates are spaced apart from each other.Instead, a mechanism for ejecting a jet used to space the two substratesapart from each other may be independently prepared.

Sixth Embodiment

FIG. 8 is a view showing the schematic arrangement of a separatingapparatus according to the sixth embodiment of the present invention.The same reference numerals as in other drawings substantially denotethe same constituent elements in FIG. 8.

A separating apparatus 900 has a pair of substrate holding portions 920and 280. The upper substrate holding portion 920 has a Bernoulli chuck923. The lower substrate holding portion 280 and constituent elementsthereof are the same as those described above.

The Bernoulli chuck 923 ejects a gas from the center of the shade-shapedchuck radially along the shade and chucks a sample such as a bondedsubstrate stack using the fact that the central portion of the chuck hasnegative pressure.

The substrate holding portion 920 having the Bernoulli chuck 923 iscoupled to one end of an elevating shaft 910. A gas introduction portion921 of the Bernoulli chuck 923 is coupled to a pressure line 911 in theelevating shaft 910. The pressure line 911 is connected to an externalpressure line via a ring 912. The external pressure line has a solenoidvalve (not shown). The solenoid valve is ON/OFF-controlled by a controlsection as needed.

The upper substrate holding portion 920 has, at its outer peripheralportion, a plurality of guide members for preventing a bonded substratestack from causing a positional shift or projecting from the substrateholding portions during separation, like the substrate holding portionshown in FIG. 3. The guide members are preferably arranged such that therobot hand can be inserted between a substrate and the substrate holdingportion 920, like the above-described guide members 283 (273).

The other end of the elevating shaft 910 is coupled to the piston rod ofan air cylinder 740 via a coupling 730. The elevating shaft 910 issupported by an upper table 170 via a reciprocal/rotational guide 913.

Procedures of separation processing by the separating apparatus 900 willbe described below. First, the air cylinder 740 retracts the piston rodto form an appropriate gap between substrate holding portions 920 and280. In this state, the bonded substrate stack 50 is horizontallysupported by a robot hand 400 from the lower side, inserted to apredetermined position between the substrate holding portions 920 and280, and placed on the substrate holding portion 280.

The air cylinder 740 extends the piston rod to move the upper substrateholding portion 920 downward until a predetermined gap is formed betweenthe upper surface of the bonded substrate stack 50 and the Bernoullichuck 923 of the upper substrate holding portion 920.

The solenoid valve of the external pressure line is opened to blow afluid radially from the center of the Bernoulli chuck 923 of thesubstrate holding portion 920. The bonded substrate stack 50 is chucked.

A motor 790 is actuated to transmit the rotational force to a rotatingshaft 750. The rotating shaft 750, substrate holding portion 280, bondedsubstrate stack 50, substrate holding portion 920, and rotating shaft910 rotate integrally.

While keeping a shutter 251 closed, a pump (not shown) connected to anozzle 260 is actuated to feed a high-pressure jet medium (e.g., water)to the nozzle 260 high-pressure jet is ejected from the nozzle 260. Whenthe jet stabilizes, the shutter 251 is opened. The jet ejected from thenozzle 260 is continuously injected into the porous layer of the bondedsubstrate stack 50 to start separating the bonded substrate stack 50.

When separation of the bonded substrate stack 50 is ended, the shutter251 is closed, and the pump connected to the nozzle 260 is stopped tostop jet injection into the bonded substrate stack 50. The operation ofthe motor 790 is also stopped.

While keeping the Bernoulli chuck 923 of the substrate holding portion920 actuating, the vacuum chuck mechanism of the substrate holdingportion 280 is actuated to cause the substrate holding portion 920 tovacuum-chuck the upper separated substrate and the substrate holdingportion 280 to vacuum-chuck the lower separated substrate.

The air cylinder 740 retracts the piston rod to form a predetermined gapbetween the substrate holding portions 920 and 280. The two separatedsubstrates are spaced apart from each other.

The robot hand 400 is inserted between the substrate and the substrateholding portion 920. The robot hand 400 chucks the substrate. Afterthat, chuck by the Bernoulli chuck 923 of the substrate holding portion920 is canceled. The substrate is transferred from the substrate holdingportion 920 to the robot hand 400. The robot hand 400 conveys thesubstrate to a predetermined position (e.g., a cassette).

The robot hand 400 is inserted between the substrate and the substrateholding portion 280. The robot hand 400 chucks the substrate. Afterthat, chuck by the vacuum chuck mechanism of the substrate holdingportion 280 is canceled. The substrate is transferred from the substrateholding portion 280 to the robot hand 400. The robot hand 400 conveysthe substrate to a predetermined position (e.g., a cassette). The twoseparated substrates may be received by the robot hand in the reverseorder or simultaneously received by two robot hands (not shown).

After the bonded substrate stack 50 is separated into two substrates,the jet medium is present between the two substrates. When the jetmedium is a liquid (e.g., water), the surface tension is considerablylarge. Hence, to space the two substrates apart from each other with asmall force, a jet is preferably supplied from the nozzle 260 to the gapbetween the two substrates. In this case, the jet from the nozzle 260 isstopped after the two substrates are spaced apart from each other.Instead, a mechanism for ejecting a jet used to space the two substratesapart from each other may be independently prepared.

As described above, when the substrate holding portion 920 uses theBernoulli chuck 923, and the distance between the substrate holdingportion 920 and the bonded substrate stack 50 is adjusted, the force(press force or suction force) applied to the bonded substrate stack 50by the substrate holding portion 920 can be adjusted.

Seventh Embodiment

FIG. 9 is a view showing the schematic arrangement of a separatingapparatus according to the seventh embodiment of the present invention.The same reference numerals as in other drawings substantially denotethe same constituent elements in FIG. 9.

A separating apparatus 1000 has a pair of substrate holding portions 270and 1010. The lower substrate holding portion 1010 has a Bernoulli chuck1013. The upper, substrate holding portion 270 and constituent elementsthereof are the same as those described above.

The Bernoulli chuck 1013 ejects a gas from the center of theshade-shaped chuck radially along the shade and chucks a sample such asa bonded substrate stack using the fact that the central portion of thechuck has negative pressure.

The substrate holding portion 1010 having the Bernoulli chuck 1013 iscoupled to one end of an elevating shaft 1020. A gas introductionportion 1011 of the Bernoulli chuck 1013 is coupled to a pressure line1021 in the elevating shaft 1020. The pressure line 1021 is connected toan external pressure line via a ring 1022. The external pressure linehas a solenoid valve (not shown) The solenoid valve is ON/OFF-controlledby a control section as needed.

The lower substrate holding portion 1010 has, at its outer peripheralportion, a plurality of guide members for preventing a bonded substratestack from causing a positional shift or projecting from the substrateholding portions during separation, like the substrate holding portionshown in FIG. 3. The guide members are preferably arranged such that therobot hand can be inserted between a substrate and the substrate holdingportion 1010, like the above-described guide members 283 (273).

The other end of the elevating shaft 1020 is coupled to the piston rodof an air cylinder 320 via a coupling 330. The elevating shaft 1020 issupported by a lower table 240 via a reciprocal/rotational guide 1030.

Procedures of separation processing by the separating apparatus 1000will be described below. First, the air cylinder 320 retracts the pistonrod to form an appropriate gap between substrate holding portions 270and 1010. In this state, the bonded substrate stack 50 is horizontallysupported by a robot hand 400 from the lower side, inserted to apredetermined position between the substrate holding portions 270 and1010, and placed on the substrate holding portion 1010.

The air cylinder 320 extends the piston rod to move the lower substrateholding portion 1010 upward until a predetermined gap is formed betweenthe upper surface of the bonded substrate stack 50 and the supportportion of the upper substrate holding portion 270.

The solenoid valve of the external pressure line is opened to blow afluid radially from the center of the Bernoulli chuck 1013 of thesubstrate holding portion 1010. The bonded substrate stack 50 ischucked.

A motor 110 is actuated to transmit the rotational force to a rotatingshaft 140. The rotating shaft 140, substrate holding portion 270, bondedsubstrate stack 50, substrate holding portion 1010, and rotating shaft1020 rotate integrally.

While keeping a shutter 251 closed, a pump (not shown) connected to anozzle 260 is actuated to feed a high-pressure jet medium (e.g., water)to the nozzle 260. A high-pressure jet is ejected from the nozzle 260.When the jet stabilizes, the shutter 251 is opened. The jet ejected fromthe nozzle 260 is continuously injected into the porous layer of thebonded substrate stack 50 to start separating the bonded substrate stack50.

When separation of the bonded substrate stack 50 is ended, the shutter251 is closed, and the pump connected to the nozzle 260 is stopped tostop jet injection into the bonded substrate stack 50. The operation ofthe motor 110 is also stopped.

While keeping the Bernoulli chuck 1013 of the substrate holding portion1010 actuating, the vacuum chuck mechanism of the substrate holdingportion 270 is actuated to cause the substrate holding portion 270 tovacuum-chuck the upper separated substrate and the Bernoulli chuck ofthe substrate holding portion 1010 to vacuum-chuck the lower separatedsubstrate.

The air cylinder 320 retracts the piston rod to form a predetermined gapbetween the substrate holding portions 270 and 1101. The two separatedsubstrates are spaced apart from each other.

The robot hand 400 is inserted between the substrate and the substrateholding portion 270. The robot hand 400 chucks the substrate. Afterthat, vacuum chuck by the substrate holding portion 270 is canceled. Thesubstrate is transferred from the substrate holding portion 270 to therobot hand 400. The robot hand 400 conveys the substrate to apredetermined position (e.g., a cassette) The robot hand 400 is insertedbetween the substrate and the Bernoulli chuck 1013 of the substrateholding portion 1010. The robot hand 400 chucks the substrate. Afterthat, chuck by the Bernoulli chuck 1013 of the substrate holding portion1010 is canceled. The substrate is transferred from the substrateholding portion 1010 to the robot hand 400. The robot hand 400 conveysthe substrate to a predetermined position (e.g., a cassette). The twoseparated substrates may be received by the robot hand in the reverseorder or simultaneously received by two robot hands (not shown).

After the bonded substrate stack 50 is separated into two substrates,the jet medium is present between the two substrates. When the jetmedium is a liquid (e.g., water), the surface tension is considerablylarge. Hence, to space the two substrates apart from each other with asmall force, a jet is preferably supplied from the nozzle 260 to the gapbetween the two substrates. In this case, the jet from the nozzle 260 isstopped after the two substrates are spaced apart from each other.Instead, a mechanism for ejecting a jet used to space the two substratesapart from each other may be independently prepared.

As described above, when the substrate holding portion 1010 uses theBernoulli chuck 1013, and the distance between the substrate holdingportion 1010 and the bonded substrate stack 50 is adjusted, the force(press force or suction force) applied to the bonded substrate stack 50by the substrate holding portion 1010 can be adjusted.

Eighth Embodiment

FIG. 10 is a view showing the schematic arrangement of a separatingapparatus according to the eighth embodiment of the present invention.The same reference numerals as in other drawings substantially denotethe same constituent elements in FIG. 10.

A separating apparatus 1100 has a pair of substrate holding portions 270and 280. Both the pair of substrate holding portions 270 and 280 arebrought into contact with a bonded substrate stack 50 to press and holdthe bonded substrate stack 50. As the force for pressing the bondedsubstrate stack 50, pressure of a fluid (a gas or a liquid) is used.

The lower substrate holding portion 280 is coupled to a rotating shaft1113. The rotating shaft 1113 is supported by a lower support 1110 via areciprocal/rotational guide 1112. The substrate holding portion 280 hasa suction hole 281 for vacuum-chucking the bonded substrate stack 50.The suction hole 281 is connected to a vacuum line 1116 in the rotatingshaft 1113. The vacuum line 1116 is connected to an external vacuum linevia a ring 1114. The external vacuum line has a solenoid valve (notshown). The solenoid valve is ON/OFF-controlled by a control section asneeded.

The lower support 1110 has a fluid blow portion 1111. The blow portion1111 is connected to an external pressure line. The external pressureline has a solenoid valve (not shown). The solenoid valve isON/OFF-controlled by the control section as needed.

The lower support 1110 is coupled to an elevating table 1115 fixed tothe piston rod of an air cylinder 1101 and vertically moves inaccordance with the vertical movement of the elevating table 1115. Theair cylinder 1101 is fixed to a support table 1102.

The upper substrate holding portion 270 and constituent elements thereofare the same as those described above.

When the bonded substrate stack 50 is held by the above arrangement,warp of the bonded substrate stack 50 during separation is more limitedthan in the separating apparatus shown in FIGS. 5 or 6. The stability ofthe bonded substrate stack 50 in separation can be increased, and forexample, swing of the bonded substrate stack 50 can be prevented.

Procedures of separation processing by the separating apparatus 1100will be described below. First, the air cylinder 1101 retracts thepiston rod to form an appropriate gap between substrate holding portions270 and 280. In this state, the bonded substrate stack 50 ishorizontally supported by a robot hand 400 from the lower side, insertedto a predetermined position between the substrate holding portions 270and 280, and placed on the substrate holding portion 280.

The air cylinder 1101 extends the piston rod to move the lower substrateholding portion 280 upward until a predetermined gap is formed betweenthe upper surface of the bonded substrate stack 50 and the supportportion of the upper substrate holding portion 270.

The solenoid valve of the external pressure line is opened to blow afluid from the blow portion 1111 of the lower support 1110. The lowersubstrate holding portion 280 is moved upward to press and hold thebonded substrate stack 50.

A motor 110 is actuated to transmit the rotational force to a rotatingshaft 140. The rotating shaft 140, substrate holding portion 270, bondedsubstrate stack 50, substrate holding portion 280, and rotating shaft1113 rotate integrally.

While keeping a shutter 251 closed, a pump (not shown) connected to anozzle 260 is actuated to feed a high-pressure jet medium (e.g., water)to the nozzle 260. A high-pressure jet is ejected from the nozzle 260.When the jet stabilizes, the shutter 251 is opened. The jet ejected fromthe nozzle 260 is continuously injected into the porous layer of thebonded substrate stack 50 to start separating the bonded substrate stack50.

When separation of the bonded substrate stack 50 is ended, the shutter251 is closed, and the pump connected to the nozzle 260 is stopped tostop jet injection into the bonded substrate stack 50. The operation ofthe motor 110 is also stopped.

The vacuum chuck mechanisms of the substrate holding portions 270 and280 are actuated (solenoid valves are opened) to cause the substrateholding portion 270 to vacuum-chuck the upper separated substrate andthe substrate holding portion 280 to vacuum-chuck the lower separatedsubstrate.

The air cylinder 1101 retracts the piston rod to form a predeterminedgap between the substrate holding portions 270 and 280. The twoseparated substrates are spaced apart from each other.

The robot hand 400 is inserted between the substrate and the substrateholding portion 270. The robot hand 400 chucks the substrate. Afterthat, chuck by the vacuum chuck mechanism of the substrate holdingportion 270 is canceled. The substrate is transferred from the substrateholding portion 270 to the robot hand 400. The robot hand 400 conveysthe substrate to a predetermined position (e.g., a cassette).

The robot hand 400 is inserted between the substrate and the substrateholding portion 280. The robot hand 400 chucks the substrate. Afterthat, chuck by the vacuum chuck mechanism of the substrate holdingportion 280 is canceled. The substrate is transferred from the substrateholding portion 280 to the robot hand 400. The robot hand 400 conveysthe substrate to a predetermined position (e.g., a cassette). The twoseparated substrates may be received by the robot hand in the reverseorder or simultaneously received by two robot hands (not shown).

After the bonded substrate stack 50 is separated into two substrates,the jet medium is present between the two substrates. When the jetmedium is a liquid (e.g., water), the surface tension is considerablylarge. Hence, to space the two substrates apart from each other with asmall force, a jet is preferably supplied from the nozzle 260 to the gapbetween the two substrates. In this case, the jet from the nozzle 260 isstopped after the two substrates are spaced apart from each other.Instead, a mechanism for ejecting a jet used to space the two substratesapart from each other may be independently prepared.

Ninth Embodiment

FIG. 11 is a view showing the schematic arrangement of a separatingapparatus according to the ninth embodiment of the present invention.The same reference numerals as in other drawings substantially denotethe same constituent elements in FIG. 11.

A separating apparatus 1200 has a pair of substrate holding portions 270and 280. Both the pair of substrate holding portions 270 and 280 arebrought into contact with a bonded substrate stack 50 to press and holdthe bonded substrate stack 50. As the force for pressing the bondedsubstrate stack 50, pressure of a fluid (a gas or a liquid) is used.

The lower substrate holding portion 280 is coupled to a rotating shaft1220. The rotating shaft 1220 is supported by a lower support 1210 via areciprocal/rotational guide 1213. The substrate holding portion 280 hasa suction hole 281 for vacuum-chucking the bonded substrate stack 50.The suction hole 281 is connected to a vacuum line 1221 in the rotatingshaft 1220. The vacuum line 1221 is connected to an external vacuum linevia a ring 1222. The external vacuum line has a solenoid valve (notshown). The solenoid valve is ON/OFF-controlled by a control section asneeded.

The lower support 1210 has a fluid blow portion 1212. The blow portion1212 is connected to an external pressure line. The external pressureline has a solenoid valve (not shown). The solenoid valve isON/OFF-controlled by the control section (not shown) as needed. Thelower support 1210 has a discharge line 1211 for externally dischargingthe fluid blown from the blow portion 1212.

The lower support 1210 is coupled to an elevating table 1115 fixed tothe piston rod of an air cylinder 1101 and vertically moves inaccordance with the vertical movement of the elevating table 1115.

The arrangement of the upper substrate holding portion 270 andconstituent elements thereof is the same as described above.

When the bonded substrate stack 50 is held by the above arrangement,warp of the bonded substrate stack 50 during separation is more limitedthan in the separating apparatus shown in FIG. 7. The stability of thebonded substrate stack 50 in separation can be increased, and forexample, swing of the bonded substrate stack 50 can be prevented.

Procedures of separation processing by the separating apparatus 1200will be described below. First, the air cylinder 1101 retracts thepiston rod to form an appropriate gap between substrate holding portions270 and 280. In this state, the bonded substrate stack 50 ishorizontally supported by a robot hand 400 from the lower side, insertedto a predetermined position between the substrate holding portions 270and 280, and placed on the substrate holding portion 280.

The air cylinder 1101 extends the piston rod to move the lower substrateholding portion 280 upward until a predetermined gap is formed betweenthe upper surface of the bonded substrate stack 50 and the supportportion of the upper substrate holding portion 270.

The solenoid valve of the external pressure line is opened to blow afluid from the blow portion 1212 of the lower support 1210. The lowersubstrate holding portion 280 is moved upward to press and hold thebonded substrate stack 50.

A motor 110 is actuated to transmit the rotational force to a rotatingshaft 140. The rotating shaft 140, substrate holding portion 270, bondedsubstrate stack. 50, substrate holding portion 280, and rotating shaft1220 rotate integrally.

While keeping a shutter 251 closed, a pump (not shown) connected to anozzle 260 is actuated to feed a high-pressure jet medium (e.g., water)to the nozzle 260. A high-pressure jet is ejected from the nozzle 260.When the jet stabilizes, the shutter 251 is opened. The jet ejected fromthe nozzle 260 is continuously injected into the porous layer of thebonded substrate stack 50 to start separating the bonded substrate stack50.

When separation of the bonded substrate stack 50 is ended, the shutter251 is closed, and the pump connected to the nozzle 260 is stopped tostop jet injection into the bonded substrate stack 50. The operation ofthe motor 110 is also stopped.

The vacuum chuck mechanisms of the substrate holding portions 270 and280 are actuated (solenoid valves are opened) to cause the substrateholding portion 270 to vacuum-chuck the upper separated substrate andthe substrate holding portion 280 to vacuum-chuck the lower separatedsubstrate.

The air cylinder 1101 retracts the piston rod to form a predeterminedgap between the substrate holding portions 270 and 280. The twoseparated substrates are spaced apart from each other.

The robot hand 400 is inserted between the substrate and the substrateholding portion 270. The robot hand 400 chucks the substrate. Afterthat, chuck by the vacuum chuck mechanism of the substrate holdingportion 270 is canceled. The substrate is transferred from the substrateholding portion 270 to the robot hand 400. The robot hand 400 conveysthe substrate to a predetermined position (e.g., a cassette).

The robot hand 400 is inserted between the substrate and the substrateholding portion 280. The robot hand.400 chucks the substrate. Afterthat, chuck by the vacuum chuck mechanism of the substrate holdingportion 280 is canceled. The substrate is transferred from the substrateholding portion 280 to the robot hand 400. The robot hand 400 conveysthe substrate to a predetermined position (e.g., a cassette). The twoseparated substrates may be received by the robot hand in the reverseorder or simultaneously received by two robot hands (not shown).

After the bonded substrate stack 50 is separated into two substrates,the jet medium is present between the two substrates. When the jetmedium is a liquid (e.g., water), the surface tension is considerablylarge. Hence, to space the two substrates apart from each other with asmall force, a jet is preferably supplied from the nozzle 260 to the gapbetween the two substrates. In this case, the jet from the nozzle 260 isstopped after the two substrates are spaced apart from each other.Instead, a mechanism for ejecting a jet used to space the two substratesapart from each other may be independently prepared.

Tenth Embodiment

FIG. 12 is a view showing the schematic arrangement of a separatingapparatus according to the 10th embodiment of the present invention. Thesame reference numerals as in other drawings substantially denote thesame constituent elements in FIG. 12.

A separating apparatus 1300 has a pair of substrate holding portions 270and 1310. Both the pair of substrate holding portions 270 and 1310 arebrought into contact with a bonded substrate stack 50 to press and holdthe bonded substrate stack 50. The force applied to the bonded substratestack 50 is controlled by a Bernoulli chuck 1320.

The lower substrate holding portion 1310 has a suction hole 1312 forvacuum-chucking the bonded substrate stack 50. The suction hole 1312 iscoupled to one end of a solenoid valve 1311 controlled by a controlsection (not shown). The solenoid valve 1311 is attached to thesubstrate holding portion 1310 via a bearing 1313. This allows thesubstrate holding portion 1310 to rotate while fixing the solenoid valve1311. When the substrate holding portion 1310 is rotated while fixingthe solenoid valve 1311, the control line for controlling the solenoidvalve 1311 can be prevented from winding as the substrate holdingportion 1310 rotates. The other end of the solenoid valve 1311communicates with the downside.

The lower substrate holding portion 1310 has, at its outer peripheralportion, a plurality of guide members for preventing a bonded substratestack from causing a positional shift or projecting from the substrateholding portions during separation, like the substrate holding portionshown in FIG. 3. The guide members are preferably arranged such that therobot hand can be inserted between a substrate and the substrate holdingportion 1310, like the above-described guide members 283 (273).

The lower substrate holding portion 1310 is supported by a supportformed from the Bernoulli chuck 1320. The Bernoulli chuck 1320 ejects agas from the center of the shade-shaped chuck radially along the shadeand applies a force to the substrate holding portion 1310 using the factthat the central portion of the chuck has negative pressure.

The Bernoulli chuck 1320 is coupled to one end of an elevating shaft1020. A gas introduction portion 1321 of the Bernoulli chuck 1320 isconnected to a pressure line 1021 in the elevating shaft 1020. Thepressure line 1021 is connected to an external pressure line via a ring1022. The external pressure line has a solenoid valve (not shown) Thesolenoid valve is ON/OFF-controlled by a control section as needed.

The other end of the elevating shaft 1020 is coupled to the piston rodof an air cylinder 320 via a coupling 330. The elevating shaft 1020 issupported by a lower table 240 via a reciprocal/rotational guide 1030.

Procedures of separation processing by the separating apparatus 1300will be described below. First, the air cylinder 320 retracts the pistonrod to form an appropriate gap between substrate holding portions 270and 1310. In this state, the bonded substrate stack 50 is horizontallysupported by a robot hand 400 from the lower side, inserted to apredetermined position between the substrate holding portions 270 and1310, and placed on the substrate holding portion 1310.

The air cylinder 320 extends the piston rod to move the lower substrateholding portion 1310 upward until a predetermined gap is formed betweenthe upper surface of the bonded substrate stack 50 and the supportportion of the upper substrate holding portion 270.

The solenoid valve of the external pressure line is opened to blow afluid from the gas introduction portion 1321 of the Bernoulli chuck1320. A predetermined force is applied to the lower substrate holdingportion 1310 such that the substrate holding portions 270 and 1310sandwiches and holds the bonded substrate stack 50 from both sides. Atthis time, to make the bonded substrate stack 50 freely warp, thesolenoid valve 1311 is preferably closed. However, the solenoid valve1311 may be opened.

A motor 110 is actuated to transmit the rotational force to a rotatingshaft 140. The rotating shaft 140, substrate holding portion 270, bondedsubstrate stack 50, substrate holding portion 1310, Bernoulli chuck1320, and rotating shaft 1020 rotate integrally.

While keeping a shutter 251 closed, a pump (not shown) connected to thenozzle 260 is actuated to feed a high-pressure jet medium (e.g., water)to the nozzle 260. A high-pressure jet is ejected from the nozzle 260.When the jet stabilizes, the shutter 251 is opened. The jet ejected fromthe nozzle 260 is continuously injected into the porous layer of thebonded substrate stack 50 to start separating the bonded substrate stack50.

When separation of the bonded substrate stack 50 is ended, the shutter251 is closed, and the pump connected to the nozzle 260 is stopped tostop jet injection into, the bonded substrate stack 50. The operation ofthe motor 110 is also stopped.

The vacuum chuck mechanism of the substrate holding portion 270 isactuated, and the solenoid valve 1311 of the Bernoulli chuck 1320 isopened to cause the substrate holding portion 270 to chuck the upperseparated substrate and the substrate holding portion 1310 to chuck thelower separated substrate. When the solenoid valve 1311 is open, thesubstrate holding portion 1310 can chuck the substrate because the spaceunder the solenoid valve 1311 has negative pressure due to the Bernoullichuck 1320.

The air cylinder 320 retracts the piston rod to form a predetermined gapbetween the substrate holding portions 270 and 1310. The two separatedsubstrates are spaced apart from each other.

The robot hand 400 is inserted between the substrate and the substrateholding portion 270. The robot hand 400 chucks the substrate. Afterthat, vacuum chuck by the substrate holding portion 270 is canceled. Thesubstrate is transferred from the substrate holding portion 270 to therobot hand 400. The robot hand 400 conveys the substrate to apredetermined position (e.g., a cassette).

The robot hand 400 is inserted between the substrate and the substrateholding portion 1310. The robot hand 400 chucks the substrate. Afterthat, the solenoid valve 1311 of the Bernoulli chuck 1320 is closed tocancel chuck of the substrate by the substrate holding portion 1310. Thesubstrate is transferred from the substrate holding portion 1310 to therobot hand 400. The robot hand 400 conveys the substrate to apredetermined position (e.g., a cassette). The two separated substratesmay be received by the robot hand in the reverse order or simultaneouslyreceived by two robot hands (not shown).

After the bonded substrate stack 50 is separated into two substrates,the jet medium is present between the two substrates. When the jetmedium is a liquid (e.g., water), the surface tension is considerablylarge. Hence, to space the two substrates apart from each other with asmall force, a jet is preferably supplied from the nozzle 260 to the gapbetween the two substrates. In this case, the jet from the nozzle 260 isstopped after the two substrates are spaced apart from each other.Instead, a mechanism for ejecting a jet used to space the two substratesapart from each other may be independently prepared.

Eleventh Embodiment

FIG. 13 is a view showing the schematic arrangement of a separatingapparatus according to the 11th embodiment of the present invention. Thesame reference numerals as in other drawings substantially denote thesame constituent elements in FIG. 13.

A separating apparatus 1400 has a pair of substrate holding portions 270and 280. Both the pair of substrate holding portions 270 and 280 arebrought into contact with a bonded substrate stack 50 to press and holdthe bonded substrate stack 50. As the force for pressing the bondedsubstrate stack 50, a magnetic force is used.

The lower substrate holding portion 280 is coupled to a rotating shaft1113. The rotating shaft 1113 is supported by a lower support 1401 via areciprocal/rotational guide 1112. The substrate holding portion 280 hasa suction hole 281 for vacuum-chucking the bonded substrate stack 50.The suction hole 281 is connected to a vacuum line 1116 in the rotatingshaft 1113. The vacuum line 1116 is connected to an external vacuum linevia a ring 1114. The external vacuum line has a solenoid valve (notshown). The solenoid valve is ON/OFF-controlled by a control section asneeded.

A magnet 1402 is attached to the lower substrate holding portion 280. Amagnet 1403 is attached to the upper surface of the lower support 1401at a position opposing the magnet 1402. An upward force acts on thelower substrate holding portion 280 due to the magnetic force actingbetween the magnets 1402 and 1403. As a consequence, the bondedsubstrate stack 50 is pressed.

At least one of the magnets 1402 and 1403 may be an electromagnet. Inthis case, the force for pressing the bonded substrate stack 50 can beeasily adjusted. In addition, the press force can be appropriatelychanged as separation progresses.

Procedures of separation processing by the separating apparatus 1400will be described below. First, an air cylinder 1101 retracts the pistonrod to form an appropriate gap between substrate holding portions 270and 280. In this state, the bonded substrate stack 50 is horizontallysupported by a robot hand 400 from the lower side, inserted to apredetermined position between the substrate holding portions 270 and280, and placed on the substrate holding portion 280.

The air cylinder 1101 extends the piston rod to move the lower support1401 upward. Accordingly, the lower substrate holding portion 280 ismoved upward by the magnetic force. The substrate holding portion 280presses and holds the bonded substrate stack 50.

A motor 110 is actuated to transmit the rotational force to a rotatingshaft 140. The rotating shaft 140, substrate holding portion 270, bondedsubstrate stack 50, substrate holding portion 280, and rotating shaft1113 rotate integrally.

While keeping a shutter 251 closed, a pump (not shown) connected to anozzle 260 is actuated to feed a high-pressure jet medium (e.g., water)to the nozzle 260. A high-pressure jet is ejected from the nozzle 260.When the jet stabilizes, the shutter 251 is opened. The jet ejected fromthe nozzle 260 is continuously injected into the porous layer of thebonded substrate stack 50 to start separating the bonded substrate stack50.

When separation of the bonded substrate stack 50 is ended, the shutter251 is closed, and the pump connected to the nozzle 260 is stopped tostop jet injection into the bonded substrate stack 50. The operation ofthe motor 110 is also stopped.

The vacuum chuck mechanisms of the substrate holding portions 270 and280 are actuated (solenoid valves are opened) to cause the substrateholding portion 270 to vacuum-chuck the upper separated substrate andthe substrate holding portion 280 to vacuum-chuck the lower separatedsubstrate.

The air cylinder 1101 retracts the piston rod to form a predeterminedgap between the substrate holding portions 270 and 280. The twoseparated substrates are spaced apart from each other.

The robot hand 400 is inserted between the substrate and the substrateholding portion 270. The robot hand 400 chucks the substrate. Afterthat, chuck by the vacuum chuck mechanism of the substrate holdingportion 270 is canceled. The substrate is transferred from the substrateholding portion 270 to the robot hand 400. The robot hand 400 conveysthe substrate to a predetermined position (e.g., a cassette).

The robot hand 400 is inserted between the substrate and the substrateholding portion 280. The robot hand 400 chucks the substrate. Afterthat, chuck by the vacuum chuck mechanism of the substrate holdingportion 280 is canceled. The substrate is transferred from the substrateholding portion 280 to the robot hand 400. The robot hand 400 conveysthe substrate to a predetermined position (e.g., a cassette). The twoseparated substrates may be received by the robot hand in the reverseorder or simultaneously received by two robot hands (not shown).

After the bonded substrate stack 50 is separated into two substrates,the jet medium is present between the two substrates. When the jetmedium is a liquid (e.g., water), the surface tension is considerablylarge. Hence, to space the two substrates apart from each other with asmall force, a jet is preferably supplied from the nozzle 260 to the gapbetween the two substrates. In this case, the jet from the nozzle 260 isstopped after the two substrates are separated. Instead, a mechanism forejecting a jet used to space the two substrates apart from each othermay be independently prepared.

Twelfth Embodiment

FIG. 14 is a view showing the schematic arrangement of a separatingapparatus according to the 12th embodiment of the present invention. Thesame reference numerals as in other drawings substantially denote thesame constituent elements in FIG. 14.

A separating apparatus 1500 has a pair of substrate holding portions 270and 280. The substrate holding portions 270 and 280 horizontally hold abonded substrate stack 50 by sandwiching it from the upper and lowersides. A jet is ejected from a nozzle 260 and injected to a portion nearthe porous layer of the bonded substrate stack 50, thereby separatingthe bonded substrate stack 50 into two substrates at the porous layer.The separating apparatus 1500 controls the position of the nozzle 260with reference to the lower substrate holding portion 280.

The upper substrate holding portion 270 is coupled to one end of arotating shaft 1503. The other end of the rotating shaft 1503 is coupledto the piston rod of an air cylinder 1501 via a coupling 1502. A vacuumline 1504 for vacuum-chucking the bonded substrate stack 50 on thesubstrate holding portion 270 extends through the rotating shaft 1503.The vacuum line 1504 is connected to an external vacuum line via a ring1505. The external vacuum line has a solenoid valve (not shown). Thesolenoid valve is ON/OFF-controlled by the control section as needed.The substrate holding portion 270 has a suction hole 271 forvacuum-chucking the bonded substrate stack 50. The suction hole 271 isconnected to the vacuum line 1504. The suction hole 271, vacuum line1504, and solenoid valve construct the vacuum chuck mechanism of thesubstrate holding portion 270. The rotating shaft 1503 is supported byan upper table 170 via a reciprocal/rotational guide 1506.

The lower substrate holding portion 280 is coupled to one end of arotating shaft 750. The other end of the rotating shaft 750 is coupledto the rotating shaft of a motor 790 via a coupling 770. The motor 790is fixed to a support member 780 fixed to a lower table 240. The motor790 is controlled by the control section.

A vacuum line 751 for vacuum-chucking the bonded substrate stack 50 onthe substrate holding portion 280 extends through the rotating shaft750. The vacuum line 751 is connected to an external vacuum line via aring 760. The external vacuum line has a solenoid valve (not shown) Thesolenoid valve is ON/OFF-controlled by the control section as needed.The substrate holding portion 280 has a suction hole 281 forvacuum-chucking the bonded substrate stack 50. The suction hole 281 isconnected to the vacuum line 751. The suction hole 281, vacuum line 751,and solenoid valve construct the vacuum chuck mechanism of the substrateholding portion 280. The rotating shaft 750 is supported by the lowertable 240 via a bearing 230.

The nozzle 260 is attached to, e.g., the lower table 240 via a supportmember (not shown). In the separating apparatus 1500 of the 12thembodiment, the position of the nozzle 260 is controlled with referenceto the position of the lower substrate holding portion 280. A shutter251 driven by a motor 250 is inserted between the nozzle 260 and thesubstrate holding portions 270 and 280. When the shutter 251 is open,and a jet is ejected from the nozzle 260, the jet can be injected intothe bonded substrate stack 50. When the shutter 251 is closed, jetinjection into the bonded substrate stack 50 can be stopped.

Procedures of separation processing by the separating apparatus 1500will be described below. First, the air cylinder 1501 retracts thepiston rod to form an appropriate gap between substrate holding portions270 and 280. In this state, the bonded substrate stack 50 ishorizontally supported by a robot hand 400 from the lower side, insertedto a predetermined position between the substrate holding portions 270and 280, and placed on the substrate holding portion 280.

The air cylinder 1501 extends the piston rod to move the upper substrateholding portion 270 downward. The substrate holding portions 270 and 280press and hold the bonded substrate stack 50.

The motor 790 is actuated to transmit the rotational force to therotating shaft 750. The rotating shaft 750, substrate holding portion280, bonded substrate stack 50, substrate holding portion 270, androtating shaft 1503 rotate integrally.

While keeping a shutter 251 closed, a pump (not shown) connected to anozzle 260 is actuated to feed a high-pressure jet medium (e.g., water)to the nozzle 260. A high-pressure jet is ejected from the nozzle 260.When the jet stabilizes, the shutter 251 is opened. The jet ejected fromthe nozzle 260 is continuously injected into the porous layer of thebonded substrate stack 50 to start separating the bonded substrate stack50.

When separation of the bonded substrate stack 50 is ended, the shutter251 is closed, and the pump connected to the nozzle 260 is stopped tostop jet injection into the bonded substrate stack 50. The operation ofthe motor 790 is also stopped.

The vacuum chuck mechanisms of the substrate holding portions 270 and280 are actuated (solenoid valves are opened) to cause the substrateholding portion 270 to vacuum-chuck the upper separated substrate andthe substrate holding portion 280 to vacuum-chuck the lower separatedsubstrate.

The air cylinder 1501 retracts the piston rod to form a predeterminedgap between the substrate holding portions 270 and 280. The twoseparated substrates are spaced apart from each other.

The robot hand 400 is inserted between the substrate and the substrateholding portion 270. The robot hand 400 chucks the substrate. Afterthat, chuck by the vacuum chuck mechanism of the substrate holdingportion 270 is canceled. The substrate is transferred from the substrateholding portion 270 to the robot hand 400. The robot hand 400 conveysthe substrate to a predetermined position (e.g., a cassette).

The robot hand 400 is inserted between the substrate and the substrateholding portion 280. The robot hand 400 chucks the substrate. Afterthat, chuck by the vacuum chuck mechanism of the substrate holdingportion 280 is canceled. The substrate is transferred from the substrateholding portion 280 to the robot hand 400. The robot hand 400 conveysthe substrate to a predetermined position (e.g., a cassette). The twoseparated substrates may be received by the robot hand in the reverseorder or simultaneously received by two robot hands (not shown).

After the bonded substrate stack 50 is separated into two substrates,the jet medium is present between the two substrates. When the jetmedium is a liquid (e.g., water), the surface tension is considerablylarge. Hence, to space the two substrates apart from each other with asmall force, a jet is preferably supplied from the nozzle 260 to the gapbetween the two substrates. In this case, the jet from the nozzle 260 isstopped after the two substrates are spaced apart from each other.Instead, a mechanism for ejecting a jet used to space the two substratesapart from each other may be independently prepared.

Thirteenth Embodiment

FIG. 15 is a view showing the schematic arrangement of a separatingapparatus according to the 13th embodiment of the present invention. Thesame reference numerals as in other drawings substantially denote thesame constituent elements in FIG. 15.

A separating apparatus 1600 has a pair of substrate holding portions 270and 280. A press force is applied to both of the pair of substrateholding portions 270 and 280 such that a bonded substrate stack ispressed and held from both sides.

The upper substrate holding portion 270 is coupled to one end of arotating shaft 1503. The other end of the rotating shaft 1503 is coupledto a gear 1601. The gear 1601 is coupled to the piston rod of an aircylinder 1501 via a coupling 1502. A vacuum line 1504 forvacuum-chucking a bonded substrate stack 50 on the substrate holdingportion 270 extends through the rotating shaft 1503. The vacuum line1504 is connected to an external vacuum line via a ring 1505. Theexternal vacuum line has a solenoid valve (not shown). The solenoidvalve is ON/OFF-controlled by the control section as needed. Thesubstrate holding portion 270 has a suction hole 271 for vacuum-chuckingthe bonded substrate stack 50. The suction hole 271 is connected to thevacuum line 1504. The suction hole 271, vacuum line 1504, and solenoidvalve construct the vacuum chuck mechanism of the substrate holdingportion 270. The rotating shaft 1503 is supported by an upper table 170via a reciprocal/rotational guide 1506.

The gear 1601 engages with a gear 1604 axially supported by a bearing1605. The gear 1604 is coupled to a motor 1602 via a coupling 1603. Themotor 1602 is controlled by the control section. The rotational forcegenerated by the motor 1602 is transmitted to the rotating shaft 1503via the gears 1604 and 1601 to rotate the substrate holding portion 270.

The lower substrate holding portion 280 is coupled to one end of arotating shaft 180. The other end of the rotating shaft 180 is coupledto the piston rod of an air cylinder 320 via a coupling 330. A vacuumline 181 for vacuum-chucking the bonded substrate stack 50 on thesubstrate holding portion 280 extends through the rotating shaft 180.The vacuum line 181 is connected to an external vacuum line via a ring190. The external vacuum line has a solenoid valve (not shown). Thesolenoid valve is ON/OFF-controlled by the control section as needed.The substrate holding portion 280 has a suction hole 281 forvacuum-chucking the bonded substrate stack 50. The suction hole 281 isconnected to the vacuum line 181. The suction hole 281, vacuum line 181,and solenoid valve construct the vacuum chuck mechanism of the substrateholding portion 280. The rotating shaft 140 is supported by a lowertable 240 via a reciprocal/rotational guide 230.

Procedures of separation processing by the separating apparatus 1600will be described below. First, the air cylinder 1501 and/or aircylinder 320 retracts the piston rod to form an appropriate gap betweensubstrate holding portions 270 and 280. In this state, the bondedsubstrate stack 50 is horizontally supported by a robot hand 400 fromthe lower side and inserted to a predetermined position between thesubstrate holding portions 270 and 280.

The air cylinder 1501 and/or air cylinder 320 extends the piston rod.The substrate holding portions 270 and 280 press and hold the bondedsubstrate stack 50 from both sides.

The motor 1602 is actuated to transmit the rotational force to therotating shaft 1503. The rotating shaft 1503, substrate holding portion270, bonded substrate stack 50, substrate holding portion 280, androtating shaft 180 rotate integrally.

While keeping a shutter 251 closed, a pump (not shown) connected to anozzle 260 is actuated to feed a high-pressure jet medium (e.g., water)to the nozzle 260. A high-pressure jet is ejected from the nozzle 260.When the jet stabilizes, the shutter 251 is opened. The jet ejected fromthe nozzle 260 is continuously injected into the porous layer of thebonded substrate stack 50 to start separating the bonded substrate stack50.

When separation of the bonded substrate stack 50 is ended, the shutter251 is closed, and the pump connected to the nozzle 260 is stopped tostop jet injection into the bonded substrate stack 50. The operation ofthe motor 110 is also stopped.

The vacuum chuck mechanisms of the substrate holding portions 270 and280 are actuated (solenoid valves are opened) to cause the substrateholding portion 270 to vacuum-chuck the upper separated substrate andthe substrate holding portion 280 to vacuum-chuck the lower separatedsubstrate.

The air cylinder 1501 and/or air cylinder 320 retracts the piston rod toform a predetermined gap between the substrate holding portions 270 and280. The two separated substrates are spaced apart from each other.

The robot hand 400 is inserted between the substrate and the substrateholding portion 270. The robot hand 400 chucks the substrate. Afterthat, chuck by the vacuum chuck mechanism of the substrate holdingportion 270 is canceled. The substrate is transferred from the substrateholding portion 270 to the robot hand 400. The robot hand 400 conveysthe substrate to a predetermined position (e.g., a cassette).

The robot hand 400 is inserted between the substrate and the substrateholding portion 280. The robot hand 400 chucks the substrate. Afterthat, chuck by the vacuum chuck mechanism of the substrate holdingportion 280 is canceled. The substrate is transferred from the substrateholding portion 280 to the robot hand 400. The robot hand 400 conveysthe substrate to a predetermined position (e.g., a cassette). The twoseparated substrates may be received by the robot hand in the reverseorder or simultaneously received by two robot hands (not shown).

After the bonded substrate stack 50 is separated into two substrates,the jet medium is present between the two substrates. When the jetmedium is a liquid (e.g., water), the surface tension is considerablylarge. Hence, to space the two substrates apart from each other with asmall force, a jet is preferably supplied from the nozzle 260 to the gapbetween the two substrates. In this case, the jet from the nozzle 260 isstopped after the two substrates are spaced apart from each other.Instead, a mechanism for ejecting a jet used to space the two substratesapart from each other may be independently prepared.

Fourteenth Embodiment

FIGS. 16 to 19 are views showing the schematic arrangement of aseparating apparatus according to the 14th embodiment of the presentinvention. The same reference numerals as in other drawingssubstantially denote the same constituent elements in FIGS. 16 to 19.

A separating apparatus 1700 places a weight on a bonded substrate stack50 to press the bonded substrate stack 50 from the upper side, and inthis state, separates the bonded substrate stack 50. In this embodiment,two weights 1705 and 1706 are used, and the press force to be applied tothe bonded substrate stack 50 is switched as separation progresses. Itis also effective to use three or more weights and switch stepwise thepress force to be applied to the bonded substrate stack 50 as separationprogresses. Alternatively, only one weight may be used such that apredetermined press force is applied to the bonded substrate stack 50during separation processing.

The separating apparatus 1700 has an operation section 1703. Applicationof a press force to the bonded substrate stack 50 is controlled byvertically moving the operation section 1703. The operation section 1703has a first hanger portion 1703 a for supporting the first weight 1705in a suspended state, and a second hanger portion 1703 b for supportingthe second weight 1706 in the suspended state.

The operation section 1703 is coupled to the piston rod of an aircylinder 1701 via a coupling 1702 and vertically moved by the aircylinder 1701. When the operation section 1703 is moved downward to thefirst step, the total gravity acting on the first weight 1705 is appliedto the bonded substrate stack 50. When the operation section 1703 ismoved downward to the second step, the total gravity acting on thesecond weight 1706 is applied to the first weight 1705. At this time,the total gravity acting on the first weight 1705 and second weight 1706is applied to the bonded substrate stack 50. With this arrangement, thepress force to be applied to the bonded substrate stack 50 can becontrolled in two steps. When the numbers of weights and hanger portionsare increased, the press force to be applied to the bonded substratestack 50 can be controlled in more steps.

The operation section 1703 has, at its lower end, a suction hole 1704for vacuum-chucking the bonded substrate stack 50. The suction hole 1704is connected to an external vacuum line. The external vacuum line has asolenoid valve (not shown). The solenoid valve is ON/OFF-controlled bythe control section as needed.

A lower substrate holding portion 280 is coupled to one end of arotating shaft 750. The other end of the rotating shaft 750 is coupledto a motor 790 via a coupling 770. The rotating shaft 750 is supportedby a lower table 240 via a bearing 230. The motor 790 is fixed to asupport member 780 fixed to the lower table 240.

A vacuum line 751 connected to a suction hole 281 of the substrateholding portion 280 extends through the rotating shaft 750. The vacuumline 751 is connected to an external vacuum line via a ring 760. Theexternal vacuum line has a solenoid valve (not shown). The solenoidvalve is ON/OFF-controlled by the control section as needed.

FIG. 20 is a perspective view showing the schematic arrangement of theoperation section 1703 shown in FIGS. 16 to 19. The operation section1703 has, at its outer peripheral portion, a plurality of guide members1703 c for preventing a bonded substrate stack from causing a positionalshift or projecting from the operation section 1703 and substrateholding portion 280 during separation.

To make it possible for a robot hand 400 of a conveyor robot to chuckthe back side surface of the upper separated substrate and receive thesubstrate from the operation section 1703, the plurality of guidemembers 1703 c are preferably arranged at an appropriate interval suchthat the robot hand 400 can enter/leave.

The operation section 1703 also has convex support portions 1703 d suchthat the robot hand 400 can be inserted between the substrate and thelower end of the operation section 1703 while chucking the substrate.

Procedures of separation processing by the separating apparatus 1700will be described below sequentially with reference to FIGS. 16 to 19.First, the air cylinder 1701 retracts the piston rod to form anappropriate gap between the substrate holding portion 280 and the lowerend of the operation section 1703. The bonded substrate stack 50 ishorizontally supported by the robot hand 400 from the lower side,inserted to a predetermined position between the substrate holdingportion 280 and the lower end of the operation section 1703, and placedon the substrate holding portion 280.

As shown in FIG. 17, the air cylinder 1701 extends the piston rod tomove the operation section 1703 downward to the first step, therebyapplying the total gravity acting on the first weight 1705 to the bondedsubstrate stack 50.

While keeping a shutter 251 closed, a pump (not shown) connected to anozzle 260 is actuated to feed a high-pressure jet medium (e.g., water)to the nozzle 260. A high-pressure jet is ejected from the nozzle 260.When the jet stabilizes, the shutter 251 is opened. The jet ejected fromthe nozzle 260 is continuously injected into the porous layer of thebonded substrate stack 50 to start separating the bonded substrate stack50 (first step of separation).

When separation of the outer peripheral portion (portion around thecentral portion) of the bonded substrate stack 50 is ended, the aircylinder 1701 further extends the piston rod to move the operationsection 1703 to the second step, as shown in FIG. 18, while continuingseparation. The total gravity acting on the first weight 1705 and secondweight 1706 is applied to the bonded substrate stack 50 (second step ofseparation). The bonded substrate stack 50 is pressed by a force largerthan that in the first step of separation. The first weight 1705preferably weighs, e.g., about 100 g, and the second weight 1706preferably weighs, e.g., about 150 g.

In this embodiment in which the bonded substrate stack 50 is separatedwhile rotating it, at the step (first step of separation) of separatingthe outer peripheral portion of the bonded substrate stack 50, thebonded substrate stack 50 is pressed by a relatively small force. At thestep (second step of separation) of separating the central portion ofthe bonded substrate stack 50, the bonded substrate stack 50 is pressedby a relatively large force. The reason for this is as follows.

When the outer peripheral portion of the bonded substrate stack 50 is tobe separated (first step), the area of the separated portion is small,and the jet medium injected into the bonded substrate stack 50 isefficiently discharged. For this reason, the force (separation force)acting to space the already separated portions apart from each other isrelatively small. On the other hand, when the central portion of thebonded substrate stack 50 is to be separated (second step), the area ofthe separated portion is large, and the jet medium injected into thebonded substrate stack 50 is hardly discharged. Hence, the press forcerequired to stably hold the bonded substrate stack 50 is larger in thesecond step than in the first step. At the final stage of the secondstep, i.e., final stage of separation, defects may be generated becausethe unseparated portion is separated at once. Hence, separationpreferably progresses moderately at the final stage of separation.

In separating the bonded substrate stack 50 without rotating it, whenthe outer peripheral portion of the bonded substrate stack 50 is to beseparated (first step of separation), the bonded substrate stack ispreferably pressed by a relatively large force. When the central portionof the bonded substrate stack 50 is to be separated (second step ofseparation), the bonded substrate stack is preferably pressed by arelatively small force.

When separation of the bonded substrate stack 50 is ended, the shutter251 is closed, and the pump connected to the nozzle 260 is stopped tostop jet injection into the bonded substrate stack 50. When the motor110 is being actuated, the operation of the motor 110 is also stopped.

The vacuum chuck mechanisms of the operation section 1703 and substrateholding portion 280 are actuated to cause the operation section 1703 tochuck the upper separated substrate and the substrate holding portion280 to chuck the lower separated substrate.

As shown in FIG. 19, the air cylinder 1701 retracts the piston rod toform an appropriate gap between the substrate holding portion 280 andthe lower end of the operation section 1703. The two separatedsubstrates are spaced apart from each other.

The robot hand 400 is inserted between the substrate and the lower endof the operation section 1703. The robot hand 400 chucks the substrate.After that, chuck by the vacuum chuck mechanism of the operation section1703 is canceled. The substrate is transferred from the operationsection 1703 to the robot hand 400. The robot hand 400 conveys thesubstrate to a predetermined position (e.g., a cassette).

The robot hand 400 is inserted between the substrate and the substrateholding portion 280. The robot hand 400 chucks the substrate. Afterthat, chuck by the vacuum chuck mechanism of the substrate holdingportion 280 is canceled. The substrate is transferred from the substrateholding portion 280 to the robot hand 400. The robot hand 400 conveysthe substrate to a predetermined position (e.g., a cassette). The twoseparated substrates may be received by the robot hand in the reverseorder or simultaneously received by two robot hands (not shown).

After the bonded substrate stack 50 is separated into two substrates,the jet medium is present between the two substrates. When the jetmedium is a liquid (e.g., water), the surface tension is considerablylarge. Hence, to space the two substrates apart from each other with asmall force, a jet is preferably supplied from the nozzle 260 to the gapbetween the two substrates. In this case, the jet from the nozzle 260 isstopped after the two substrates are spaced apart from each other.Instead, a mechanism for ejecting a jet used to space the two substratesmay be independently prepared.

Fifteenth Embodiment

FIG. 21 is a view showing the schematic arrangement of a separatingapparatus according to the 15th embodiment of the present invention. Aseparating apparatus 1800 has a first substrate holding portion 1801having, at its outer peripheral portion, a plurality of suction holes1802 for chucking a bonded substrate stack, and a second substrateholding portion 1809 opposing the first substrate holding portion 1801.

The lower substrate holding portion 1801 has a convex support portion1803 for forming a gap between a bonded substrate stack 50 and thesurface of the substrate holding portion 1801 to receive a robot hand400. To effectively chuck the bonded substrate stack 50 on the substrateholding portion 1801 even at the initial stage of separation, the convexsupport portion 1803 preferably has a suction hole.

The support portion 1803 is preferably located, e.g., near the centralportion of the surface of the substrate holding portion 1801. When thesupport portion 1803 is formed, the robot hand 400 can horizontallysupport the bonded substrate stack 50 from the lower side and transferit to the substrate holding portion 1801. In addition, when the supportportion 1803 is formed, after separation is ended, the robot hand 400can be inserted between the lower substrate and the substrate holdingportion 1801. The robot hand 400 can support the substrate from thelower side and receive it. Hence, the risk of dropping the substrate canbe minimized.

The substrate holding portion 1801 is coupled to one end of a rotatingshaft 1804. The rotating shaft 1804 is supported by a support table 1820via a bearing 1806. The bearing 1806 has, at its upper portion, asealing member 1805 for sealing the opening portion formed in thesupport table 1820 to pass the rotating shaft 1804. A vacuum line 1807extends through the rotating shaft 1804. The vacuum line 1807 isconnected to the plurality of suction holes 1802 of the substrateholding portion 1801. The vacuum line 1807 is also connected to anexternal vacuum line via a ring 1808. The rotating shaft 1804 is coupledto a rotation source (not shown) to be rotated by a rotational forceapplied from the rotation source.

The substrate holding portion 1809 is located above the substrateholding portion 1801. The substrate holding portion 1809 is driven by adriving mechanism 1810 to vertically move and also rotatably axiallysupported by the driving mechanism 1810. The substrate holding portion1809 preferably has a chuck mechanism for chucking the bonded substratestack 50 or separated substrate.

A nozzle 1811 is attached to, e.g., the support table 1820 via a supportmember (not shown). In the separating apparatus 1800, the position ofthe nozzle 1811 is controlled with reference to the position of thesubstrate holding portion 1801. A shutter 1812 is inserted between thenozzle 1811 and the substrate holding portion 1801. When the shutter1812 is open, and a jet is ejected from the nozzle 1811, the jet can beinjected into the bonded substrate stack 50. When the shutter 1812 isclosed, jet injection into the bonded substrate stack 50 can be stopped.

Procedures of separation processing by the separating apparatus 1800will be described below. First, the driving mechanism 1810 moves thesubstrate holding portion 1809 upward to form an appropriate gap betweenthe substrate holding portions 1809 and 1801. In this state, the bondedsubstrate stack 50 is horizontally supported by the robot hand 400 fromthe lower side and placed on the support portion 1803 of the substrateholding portion 1801. The driving mechanism 1810 moves the substrateholding portion 1809 downward to cause it to press the bonded substratestack 50. The bonded substrate stack 50 is pressed and held by thesubstrate holding portions 1809 and 1801 from both sides.

The pressure in the suction holes 1802 of the substrate holding portion1801 is reduced via the vacuum line 1807 to cause the substrate holdingportion 1801 to chuck the bonded substrate stack 50. The chuck mechanismof the substrate holding portion 1809 may be actuated at this time.

The rotation source (not shown) is actuated to transmit the rotationalforce to the rotating shaft 1804. The rotating shaft 1804, substrateholding portion 1801, bonded substrate stack 50, and substrate holdingportion 1809 rotate integrally.

While keeping the shutter 1812 closed, a pump (not shown) connected tothe nozzle 1811 is actuated to feed a high-pressure jet medium (e.g.,water) to the nozzle 1811. A high-pressure jet is ejected from thenozzle 1811. When the jet stabilizes, the shutter 1812 is opened. Thejet ejected from the nozzle 1811 is continuously injected into theporous layer of the bonded substrate stack 50 to start separating thebonded substrate stack 50.

When the outer peripheral portion of the bonded substrate stack 50 isseparated, the separated portions warp and are spaced apart from eachother. The separated portion is chucked by the substrate holding portion1801. When the entire outer peripheral portion of the bonded substratestack 50 is separated, the lower substrate of the bonded substrate stack50 is chucked by the substrate holding portion 1801 in a shade form. Inthis state, since the force for holding the bonded substrate stack 50 issufficient, holding by the substrate holding portion 1809 can becanceled by moving the substrate holding portion 1809 upward.

When separation of the bonded substrate stack 50 is ended, the shutter1812 is closed, and the pump connected to the nozzle 1811 is stopped tostop jet injection into the bonded substrate stack 50. Rotation of thebonded substrate stack 50 is stopped by stopping driving the rotatingshaft 1804.

In a state wherein the chuck mechanisms of the substrate holdingportions 1809 and 1801 are actuated, i.e., the substrate holding portion1809 is caused to chuck the upper separated substrate, and the substrateholding portion 1801 is caused to chuck the lower separated substrate,the substrate holding portion 1809 is moved upward by the drivingmechanism 1810. The two separated substrates are spaced apart from eachother.

The robot hand 400 receives the substrate held by the substrate holdingportion 1809 and conveys the substrate to a predetermined position(e.g., a cassette).

Chuck of the substrate by the vacuum chuck mechanism of the substrateholding portion 1801 is canceled. The robot hand 400 is inserted betweenthe substrate and the substrate holding portion 1801. The substrate istransferred from the substrate holding portion 1801 to the robot hand400. The robot hand 400 conveys the substrate to a predeterminedposition (e.g., a cassette). The two separated substrates may bereceived by the robot hand in the reverse order or simultaneouslyreceived by two robot hands (not shown).

After the bonded substrate stack 50 is separated into two substrates,the jet medium is present between the two substrates. When the jetmedium is a liquid (e.g., water), the surface tension is considerablylarge. Hence, to separate the two substrates with a small force, a jetis preferably supplied from the nozzle 1811 to the gap between the twosubstrates. In this case, the jet from the nozzle 1811 is stopped afterthe two substrates are separated. Instead, a mechanism for ejecting ajet used to separate the two substrates may be independently prepared.

Sixteenth Embodiment

FIGS. 22 to 24 are views showing the schematic arrangement of aseparating apparatus according to the 16th embodiment of the presentinvention. A separating apparatus 1900 has a pair of substrate holdingportions 1909 and 1901. The substrate holding portions 1909 and 1901horizontally hold a bonded substrate stack 50 by sandwiching it from theupper and lower sides. A jet is ejected from a nozzle 1921 and injectedto a portion near the porous layer of the bonded substrate stack 50,thereby separating the bonded substrate stack 50 into two substrates atthe porous layer.

In the separating apparatus 1900, when the outer peripheral portion(portion around the central portion) of the bonded substrate stack 50 isto be separated, the bonded substrate stack 50 is preferably chucked bythe substrate holding portions 1909 and 1901. When the central portionis to be separated, chuck of the bonded substrate stack 50 is preferablycanceled. This effectively prevents any defects in separation. However,this embodiment does not negate the embodiments that have been describedabove. In the above-described embodiments as well, samples such asbonded substrate stacks can be separated at a high yield. The 16thembodiment intends to prevent any defects in separating the bondedsubstrate stack 50 under a specific condition using substrate holdingportions having specific shapes and dimensions.

The lower substrate holding portion 1901 has a convex support portion1903 for forming a gap between the bonded substrate stack 50 and thesurface of the substrate holding portion 1901 to receive a robot hand400. The support portion 1903 has a suction hole 1902 forvacuum-chucking the bonded substrate stack 50. The substrate holdingportion 1901 has a shift prevention member 1911 around the supportportion 1903. The shift prevention member 1911 formed from, e.g., rubberor a resin prevents the bonded substrate stack 50 from moving in theplanar direction. With the shift prevention member 1911, the bondedsubstrate stack 50 can be held by a small press force or suction force.

The substrate holding portion 1901 is coupled to one end of a rotatingshaft 1904. The rotating shaft 1904 is supported by a support table 1920via a bearing 1906. The bearing 1906 has, at its upper portion, asealing member 1905 for sealing the opening portion formed in thesupport table 1920 to pass the rotating shaft 1904. A vacuum line 1907extends through the rotating shaft 1904. The vacuum line 1907 isconnected to the suction hole 1902 of the substrate holding portion1901. The vacuum line 1907 is also connected to an external vacuum linevia a ring 1908. The rotating shaft 1904 is coupled to a rotation source(hot shown) to be rotated by a rotational force applied from therotation source.

The substrate holding portion 1909 is located above the substrateholding portion 1901. The substrate holding portion 1909 is driven by adriving mechanism 1910 to vertically move and also rotatably axiallysupported by the driving mechanism 1910.

The upper substrate holding portion 1909 has a convex support portion1912 for forming a gap between the bonded substrate stack 50 and thesurface of the substrate holding portion 1901 to receive the robot hand400. The support portion 1912 has a suction hole 1914 forvacuum-chucking the bonded substrate stack 50. The substrate holdingportion 1909 has a shift prevention member 1913 around the supportportion 1912. The shift prevention member 1913 formed from, e.g., rubberor a resin prevents the bonded substrate stack 50 from moving in theplanar direction. With the shift prevention member 1913, the bondedsubstrate stack 50 can be held by a small press force or suction force.

The nozzle 1921 is attached to, e.g., the support table 1920 via asupport member (not shown). In the separating apparatus 1900, theposition of the nozzle 1921 is controlled with reference to the positionof the substrate holding portion 1901. A shutter 1922 is insertedbetween the nozzle 1921 and the substrate holding portion 1901. When theshutter 1922 is open, and a jet is ejected from the nozzle 1921, the jetcan be injected into the bonded substrate stack 50. When the shutter1922 is closed, jet injection into the bonded substrate stack 50 can bestopped.

Procedures of separation processing by the separating apparatus 1900will be described below. First, the driving mechanism 1910 moves thesubstrate holding portion 1909 upward to form an appropriate gap betweenthe substrate holding portions 1909 and 1901. In this state, the bondedsubstrate stack 50 is horizontally supported by the robot hand 400 fromthe lower side and placed on the support portion 1903 of the substrateholding portion 1901. The driving mechanism 1910 moves the substrateholding portion 1909 downward to cause it to press the bonded substratestack 50. The bonded substrate stack 50 is pressed and held by thesubstrate holding portions 1909 and 1901 from both sides.

The bonded substrate stack 50 is vacuum-chucked by the vacuum chuckmechanisms of the substrate holding portions 1901 and 1909.

The rotation source (not shown) is actuated to transmit the rotationalforce to the rotating shaft 1904. The rotating shaft 1904, substrateholding portion 1901, bonded substrate stack 50, and substrate holdingportion 1909 rotate integrally.

While keeping the shutter 1922 closed, a pump (not shown) connected tothe nozzle 1921 is actuated to feed a high-pressure jet medium (e.g.,water) to the nozzle 1921. A high-pressure jet is ejected from thenozzle 1921. When the jet stabilizes, the shutter 1922 is opened. Asshown in FIG. 23, the jet ejected from the nozzle 1921 is continuouslyinjected into the porous layer of the bonded substrate stack 50 to startseparating the bonded substrate stack 50. In this state, the outerperipheral portion of the bonded substrate stack 50 is separated.

When the outer peripheral portion is separated, chuck of the bondedsubstrate stack 50 by the vacuum chuck mechanisms of the substrateholding portions 1901 and 1909 is canceled, as shown in FIG. 24. In thisstate, the bonded substrate stack 50 is completely separated. Under aspecific condition, when the central portion of the bonded substratestack 50 is to be separated, chuck of the bonded substrate stack 50 iscanceled, thereby preventing any defects in the substrate in separation.

When separation of the bonded substrate stack 50 is ended, the shutter1922 is closed, and the pump connected to the nozzle 1921 is stopped tostop jet injection into the bonded substrate stack 50. Rotation of thebonded substrate stack 50 is stopped by stopping driving the rotatingshaft 1904.

The vacuum chuck mechanisms of the substrate holding portions 1901 and1909 are actuated. The upper separated substrate is chucked by thesubstrate holding portion 1909, and the lower separated substrate ischucked by the substrate holding portion 1901. The substrate holdingportion 1909 is moved upward by the driving mechanism 1910. The twoseparated substrates are spaced apart from each other.

The robot hand 400 is inserted between the substrate and the substrateholding portion 1909. The substrate is chucked by the robot hand 400.Chuck by the vacuum chuck mechanism of the substrate holding portion1909 is canceled. The substrate is transferred from the substrateholding portion 1909 to the robot hand 400. The robot hand 400 conveysthe substrate to a predetermined position (e.g., a cassette).

The robot hand 400 is inserted between the substrate and the substrateholding portion 1901. The substrate is chucked by the robot hand 400.Chuck by the vacuum chuck mechanism of the substrate holding portion1901 is canceled. The substrate is transferred from the substrateholding portion 1901 to the robot hand 400. The robot hand 400 conveysthe substrate to a predetermined position (e.g., a cassette). The twoseparated substrates may be received by the robot hand in the reverseorder or simultaneously received by two robot hands (not shown).

After the bonded substrate stack 50 is separated into two substrates,the jet medium is present between the two substrates. When the jetmedium is a liquid (e.g., water), the surface tension is considerablylarge. Hence, to space the two substrates apart from each other with asmall force, a jet is preferably supplied from the nozzle 1921 to thegap between the two substrates. In this case, the jet from the nozzle1921 is stopped after the two substrates are spaced apart from eachother. Instead, a mechanism for ejecting a jet used to space the twosubstrates apart from each other may be independently prepared.

Seventeeth Embodiment

FIGS. 25 and 26 are views showing the schematic arrangement of aseparating apparatus according to the 17th embodiment of the presentinvention. In a separating apparatus 2000, a convex support portion 2015for supporting the central portion of a bonded substrate stack 50, oneor a plurality of rotational force transmission rollers 2004 fortransmitting a rotational force to the edge portion of the bondedsubstrate stack 50 to rotate the bonded substrate stack 50, and one or aplurality of guide rollers 2002 for regulating movement of the bondedsubstrate stack 50 in the planar direction horizontally hold the bondedsubstrate stack 50 while rotating it. A jet is ejected from a nozzle2021 and injected to a portion near the porous layer of the bondedsubstrate stack 50, thereby separating the bonded substrate stack 50into two substrates at the porous layer.

The central support portion 2015 is rotatably axially supported by atable 2001 via a bearing 2017. The support portion 2015 has a suctionhole 2016 for vacuum-chucking the bonded substrate stack 50. The table2001 is fixed to a support table 2020 via a support member 2009. Avacuum line 2010 extends through the support member 2009. When thepressure in the suction hole 2016 is reduced via the vacuum line 2010,the bonded substrate stack 50 can be chucked on the central supportportion 2015.

The rotational force transmission roller 2004 is rotatably axiallysupported by the table 2001 via a bearing 2005 and also coupled to therotating shaft of a rotation source 2011. When the rotation source 2011rotates the rotational force transmission roller 2004, the bondedsubstrate stack 50 rotates. A plurality of rotational force transmissionrollers 2004 may be arranged. Especially, when the bonded substratestack 50 has an orientation flat, at least two rotational forcetransmission rollers 2004 are required to continuously rotate the bondedsubstrate stack 50. The rotational force transmission roller 2004 ispreferably located on the opposite side of the nozzle 2021. In thiscase, since the bonded substrate stack 50 is pressed by the jet ejectedfrom the nozzle 2021, the frictional force acting between the bondedsubstrate stack 50 and the rotational force transmission roller 2004becomes large, and the bonded substrate stack 50 can be efficientlyrotated.

The guide roller 2002 is rotatably axially supported by the table 2001via a bearing 2003. A plurality of guide rollers 2002 are preferablyarranged to stably hold the bonded substrate stack 50.

Each of the rotational force transmission roller 2004 and guide roller2002 can have an engaging portion (e.g., a groove) conforming to theshape of the edge portion of the bonded substrate stack 50. Such anengaging portion effectively prevents, e.g., vertical swing of thebonded substrate stack 50.

The nozzle 2021 is attached to, e.g., the support table 2020 via asupport member (not shown). In the separating apparatus 2000, theposition of the nozzle 2021 is controlled with reference to the positionof the central support portion 2015. A shutter 2022 is inserted betweenthe nozzle 2021 and the table 2001. When the shutter 2022 is open, and ajet is ejected from the nozzle 2021, the jet can be injected into thebonded substrate stack 50. When the shutter 2022 is closed, jetinjection into the bonded substrate stack 50 can be stopped.

A substrate holding portion 2014 is located above the central supportportion 2015. The substrate holding portion 2014 is driven by a drivingmechanism 2013 to move in the vertical direction. The substrate holdingportion 2014 has a chuck mechanism for chucking a separated substrate.

Procedures of separation processing by the separating apparatus 2000will be described below. First, the bonded substrate stack 50 ishorizontally supported by a robot hand 400 from the lower side andplaced on the support portion 2015 at the center of the table 2001. Atthis time, the bonded substrate stack 50 is preferably positioned bybringing it into contact with rollers 2002 and 2004. In this state, thevacuum chuck mechanism of the central support portion 2015 is preferablyactuated to cause it to chuck the bonded substrate stack 50.

The rotation source 2011 is actuated to rotate the rotational forcetransmission roller 2004. The rotational force is transmitted to thebonded substrate stack 50, so the bonded substrate stack 50 rotatestogether with the central support portion 2015.

While keeping the shutter 2022 closed, a pump (not shown) connected tothe nozzle 2021 is actuated to feed a high-pressure jet medium (e.g.,water) to the nozzle 2021. A high-pressure jet is ejected from thenozzle 2021. When the jet stabilizes, the shutter 2022 is opened. Thejet ejected from the nozzle 2021 is continuously injected into theporous layer of the bonded substrate stack 50 to start separating thebonded substrate stack 50.

When separation of the bonded substrate stack 50 is ended, the shutter2022 is closed, and the pump connected to the nozzle 2021 is stopped tostop jet injection into the bonded substrate stack 50. The operation ofthe rotation source 2011 is also stopped.

The substrate holding portion 2014 is moved downward by the drivingmechanism 2013 to abut against the upper separated substrate. The chuckmechanism of the substrate holding portion 2014 is actuated to chuck theupper separated substrate. In this state, the substrate holding portion2014 is moved upward by the driving mechanism 2013. The two separatedsubstrates are spaced apart from each other.

The robot hand 400 receives the substrate held by the substrate holdingportion 2014 and conveys the substrate to a predetermined position(e.g., a cassette).

Chuck of the substrate by the vacuum chuck mechanism of the centralsupport portion 2015 is canceled. The robot hand 400 is inserted betweenthe substrate and the substrate central support portion 2015. Thesubstrate is transferred from the central support portion 2015 to therobot hand 400. The robot hand 400 conveys the substrate to apredetermined position (e.g., a cassette). The two separated substratesmay be received by the robot hand in the reverse order or simultaneouslyreceived by two robot hands (not shown).

After the bonded substrate stack 50 is separated into two substrates,the jet medium is present between the two substrates. When the jetmedium is a liquid (e.g., water), the surface tension is considerablylarge. Hence, to space the two substrates apart from each other with asmall force, a jet is preferably supplied from the nozzle 2021 to thegap between the two substrates. In this case, the jet from the nozzle2021 is stopped after the two substrates are spaced apart from eachother. Instead, a mechanism for ejecting a jet used to space the twosubstrates apart from each other may be independently prepared.

In the above separation processing, the bonded substrate stack 50 isseparated without pressing it by the substrate holding portion 2014.However, the bonded substrate stack 50 may be separated while beingpressed by the substrate holding portion 2014. In this case, the drivingmechanism 2013 preferably rotatably supports the substrate holdingportion 2014.

Eighteenth Embodiment

FIG. 27 is a view showing the schematic arrangement of a separatingapparatus according to the 18th embodiment of the present invention. Aseparating apparatus 2100 has a plurality of chuck pins 2102 forchucking the outer peripheral portion of a bonded substrate stack 50.The plurality of chuck pins 2102 horizontally hold the bonded substratestack 50. A jet is ejected from a nozzle 2107 and injected to a portionnear the porous layer of the bonded substrate stack 50, therebyseparating the bonded substrate stack 50 into two substrates at theporous layer.

The separating apparatus 2100 has a table 2101. The table 2101 has theplurality of chuck pins 2102 for supporting the outer peripheral portionof the bonded substrate stack 50. The number of chuck pins 2102 ispreferably three or more. When the bonded substrate stack 50 has anorientation flat, the number of chuck pins 2102 is preferably four ormore. Each of the chuck pins 2102 can have an engaging portion (e.g., agroove) conforming to the shape of the edge portion of the bondedsubstrate stack 50. Such an engaging portion effectively prevents, e.g.,vertical swing of the bonded substrate stack 50.

The table 2101 has a driving mechanism for moving the chuck pins 2102 inthe radial direction (toward the center or toward the outer periphery)of the table 2101 along moving guides 2103 formed in the table 2101. Tohold the bonded substrate stack 50, first, the bonded substrate stack 50is placed on the table 2101. After this, the chuck pins 2102 are movedtoward the center of the table 2101, thereby supporting the bondedsubstrate stack 50 by the chuck pins 2102. A driving mechanism formoving not all the chuck pins 2102 but only some of the chuck pins 2102may be employed.

The table 2101 preferably has a convex support portion 2104 for forminga gap between the bonded substrate stack 50 and the surface of the table2101 to receive a robot hand 400.

The table 2101 is coupled to one end of a rotating shaft 2106. Therotating shaft 2106 is supported by a support table 2110 via a bearing2109. The bearing 2109 has, at its upper portion, a sealing member 2105for sealing the opening portion formed in the support table 2110 to passthe rotating shaft 2106. The rotating shaft 2106 is coupled to arotation source (not shown) to be rotated by the rotational forcetransmitted from the rotation source.

The nozzle 2107 is attached to, e.g., the support table 2110 via asupport member (not shown). In the separating apparatus 2100, theposition of the nozzle 2107 is controlled with reference to the positionof the table 2101. A shutter 2108 is inserted between the nozzle 2107and the table 2101. When the shutter 2108 is open, and a jet is ejectedfrom the nozzle 2107, the jet can be injected into the bonded substratestack 50. When the shutter 2108 is closed, jet injection into the bondedsubstrate stack 50 can be stopped.

Procedures of separation processing by the separating apparatus 2100will be described below. First, the chuck pins 2102 are moved toward theouter periphery by the driving mechanism to form a space on the table2101 where the bonded substrate stack 50 is to be placed.The bondedsubstrate stack 50 is horizontally supported by the robot hand 400 fromthe lower side and placed on the support portion 2104 of the table 2101.The chuck pins 2102 are moved toward the center by the driving mechanismto fix the bonded substrate stack 50. According to the separatingapparatus 2100, the bonded substrate stack 50 is positioned by movingthe chuck pins 2102 toward the center.

The rotation source (not shown) is actuated to transmit the rotationalforce to the rotating shaft 2106. The table 2101 and bonded substratestack 50 rotate together.

While keeping the shutter 2108 closed, a pump (not shown) connected tothe nozzle 2107 is actuated to feed a high-pressure jet medium (e.g.,water) to the nozzle 2107. A high-pressure jet is ejected from thenozzle 2107. When the jet stabilizes, the shutter 2108 is opened. Thejet ejected from the nozzle 2107 is continuously injected into theporous layer of the bonded substrate stack 50 to start separating thebonded substrate stack 50.

When separation of the bonded substrate stack 50 is ended, the shutter2108 is closed, and the pump connected to the nozzle 2107 is stopped tostop jet injection into the bonded substrate stack 50. Rotation of thebonded substrate stack 50 is stopped by stopping driving the rotatingshaft 2106.

The robot hand 400 is inserted between the table 2101 and the lowersubstrate and chucks the substrate. Simultaneously, the upper substrateis chucked by another robot to space the two substrates apart from eachother. The substrates are conveyed to predetermined positions (e.g.,cassettes).

The separating apparatus 2100 may have a substrate transfer mechanismformed from the substrate holding portion 2014 and driving mechanism2013 shown in FIG. 25 such that the two separated substrates areseparated by the transfer mechanism.

After the bonded substrate stack 50 is separated into two substrates,the jet medium is present between the two substrates. When the jetmedium is a liquid (e.g., water), the surface tension is considerablylarge. Hence, to space the two substrates apart from each other with asmall force, a jet is preferably supplied from the nozzle 2107 to thegap between the two substrates. In this case, the jet from the nozzle2107 is stopped after the two substrates are spaced apart from eachother. Instead, a mechanism for ejecting a jet used to space the twosubstrates apart from each other may be independently prepared.

Nineteenth Embodiment

FIGS. 28 and 29 are views showing the schematic arrangement of aseparating apparatus according to the 19th embodiment of the presentinvention. In a separating apparatus 2200, one or a plurality ofrotational force transmission rollers 2202 for transmitting a rotationalforce to the edge portion of a bonded substrate stack 50 to rotate thebonded substrate stack 50 and one or a plurality of guide rollers 2204and 2207 for regulating movement of the bonded substrate stack 50 in theplanar direction horizontally hold the bonded substrate stack 50 whilerotating it. A jet is ejected from a nozzle 2209 and injected to aportion near the porous layer of the bonded substrate stack 50, therebyseparating the bonded substrate stack 50 into two substrates at theporous layer.

The rotational force transmission roller 2202 is rotatably axiallysupported by a table 2201 via a bearing 2206 and also coupled to therotating shaft of a rotation source 2203. When the rotation source 2203rotates the rotational force transmission roller 2202, the bondedsubstrate stack 50 rotates. A plurality of rotational force transmissionrollers 2202 may be arranged. Especially, when the bonded substratestack 50 has an orientation flat, at least two rotational forcetransmission rollers 2202 are required to continuously rotate the bondedsubstrate stack 50.

Each of the guide rollers 2204 is rotatably axially supported by thetable 2201 via a bearing 2205. Each of the guide rollers 2207 isrotatably axially supported by a bearing 2208. The table 2201 has adriving mechanism for moving the bearings 2208 in the radial direction(toward the center or toward the outer periphery) of the table 2201. Tohold the bonded substrate stack 50, first, the bonded substrate stack 50is placed on the table 2201. After this, the guide rollers 2207 aremoved toward the center of the table. The table 2201 is supported on asupport table 2213.

The table 2201 preferably has a convex support portion 2211 for forminga gap between the bonded substrate stack 50 and the surface of the table2201 to receive a robot hand 400. The support portion 2211 is preferablyrotatably axially supported by the table 2201 via, e.g., a bearing 2212not to impede rotation of the bonded substrate stack 50.

The nozzle 2209 is attached to, e.g., the table 2201 via a supportmember (not shown). In the separating apparatus 2200, the position ofthe nozzle 2209 is controlled with reference to the position of thetable 2201. A shutter 2210 is inserted between the nozzle 2209 and thetable 2201. When the shutter 2210 is open, and a jet is ejected from thenozzle 2209, the jet can be injected into the bonded substrate stack 50.When the shutter 2210 is closed, jet injection into the bonded substratestack 50 can be stopped.

Procedures of separation processing by the separating apparatus 2200will be described below. First, the guide rollers 2207 are moved towardthe outer periphery by the driving mechanism to form a space on thetable 2101 where the bonded substrate stack 50 is to be placed.

The bonded substrate stack 50 is horizontally supported by the robothand 400 from the lower side and placed on the central support portion2211 of the table 2201. The guide rollers 2207 are moved toward thecenter to fix the bonded substrate stack 50. According to the separatingapparatus 2200, the bonded substrate stack 50 is positioned by movingthe guide rollers 2207 toward the center.

The rotation source 2203 is actuated to transmit the rotational force tothe rotational force transmission roller 2202, so the bonded substratestack 50 rotates.

While keeping the shutter 2210 closed, a pump (not shown) connected tothe nozzle 2209 is actuated to feed a high-pressure jet medium (e.g.,water) to the nozzle 2209. A high-pressure jet is ejected from thenozzle 2209. When the jet stabilizes, the shutter 2210 is opened. Thejet ejected from the nozzle 2209 is continuously injected into theporous layer of the bonded substrate stack 50 to start separating thebonded substrate stack 50.

When separation of the bonded substrate stack 50 is ended, the shutter2210 is closed, and the pump connected to the nozzle 2209 is stopped tostop jet injection into the bonded substrate stack 50. Rotation of thebonded substrate stack 50 is stopped by stopping driving the rotationsource 2203.

The robot hand 400 is inserted between the table 2201 and the lowersubstrate and chucks the substrate. Simultaneously, the upper substrateis chucked by another robot to space the two substrates apart from eachother. The substrates are conveyed to predetermined positions (e.g.,cassettes).

The separating apparatus 2200 may have a substrate spacing mechanismformed from the substrate holding portion 2014 and driving mechanism2013 shown in FIG. 25 such that the two separated substrates areseparated by the spacing mechanism.

After the bonded substrate stack 50 is separated into two substrates,the jet medium is present between the two substrates. When the jetmedium is a liquid (e.g., water), the surface tension is considerablylarge. Hence, to space the two substrates apart from each other with asmall force, a jet is preferably supplied from the nozzle 2209 to thegap between the two substrates. In this case, the jet from the nozzle2209 is stopped after the two substrates are spaced apart from eachother. Instead, a mechanism for ejecting a jet used to space the twosubstrates apart from each other may be independently prepared.

Twentieth Embodiment

FIG. 30 is a view showing the schematic arrangement of a separatingapparatus according to the 20th embodiment of the present invention. Ina separating apparatus 2300, one or a plurality of rotational forcetransmission members 2306 for transmitting a rotational force to abonded substrate stack 50 from its edge portion and one or a pluralityof guide members 2307 for regulating movement of the bonded substratestack 50 in the planar direction horizontally hold the bonded substratestack 50 while rotating it. A jet is ejected from a nozzle 2309 andinjected to a portion near the porous layer of the bonded substratestack 50, thereby separating the bonded substrate stack 50 into twosubstrates at the porous layer. Each of the rotational forcetransmission member 2306 and guide member 2307 preferably has a shape(rhombic shape) obtained by, e.g., bonding the bottom portions of twocones.,

The rotational force transmission member 2306 is rotatably axiallysupported by a table 2301 via a bearing 2305 and also coupled to therotating shaft of a rotation source 2303. When the rotation source 2303rotates the rotational force transmission member 2306, the bondedsubstrate stack 50 rotates. A plurality of rotational force transmissionmembers 2306 may be arranged. Especially, when the bonded substratestack 50 has an orientation flat, at least two rotational forcetransmission members 2306 are required to continuously rotate the bondedsubstrate stack 50. The guide member 2307 is rotatably axially supportedby the table 2301 via a bearing (not shown). A plurality of guidemembers 2307 may be arranged.

The separating apparatus 2300 has a driving mechanism (not shown) formoving the rotational force transmission member 2306 and/or the guidemember 2307 in the radial direction (toward the center or toward theouter periphery) of the table 2301.

When a member having a shape obtained by bonding the bottom portions oftwo cones, as described above, is employed as the rotational forcetransmission member 2306 or guide member 2307, the bonded substratestack 50 can be held by inserting the outer peripheral portion of themember into the bonding surfaces of the bonded substrate stack 50 oralready separated portions. This prevents, e.g., vertical swing of thebonded substrate stack 50 and also allows the already separated portionsof the bonded substrate stack 50 to warp and be spaced apart from eachother. As a result, the bonded substrate stack 50 can be stably held,and the separation efficiency can be increased.

The table 2301 preferably has a convex support portion 2310 for forminga gap between the bonded substrate stack 50 and the surface of the table2301 to receive a robot hand 400. The support portion 2310 is preferablyrotatably axially supported by the table 2301 via, e.g., a bearing 2311not to impede rotation of the bonded substrate stack 50.

The nozzle 2309 is attached to, e.g., the table 2301 via a supportmember (not shown). In the separating apparatus 2300, the position ofthe nozzle 2309 is controlled with reference to the position of thetable 2301. A shutter 2308 is inserted between the nozzle 2309 and thebonded substrate stack 50. When the shutter 2308 is open, and a jet isejected from the nozzle 2309, the jet can be injected into the bondedsubstrate stack 50. When the shutter 2308 is closed, jet injection intothe bonded substrate stack 50 can be stopped.

Procedures of separation processing by the separating apparatus 2300will be described below. First, the rotational force transmission member2306 and/or guide member 2307 is moved toward the outer periphery toform a space on the table 2301 where the bonded substrate stack 50 is tobe placed.

The bonded substrate stack 50 is horizontally supported by the robothand 400 from the lower side and placed on the central support portion2310 of the table 2301. The rotational force transmission member 2306and/or guide member 2307 is moved toward the center to fix the bondedsubstrate stack 50. With this operation, the bonded substrate stack 50is positioned.

The rotation source 2303 is actuated to rotate the rotational forcetransmission member 2306. The bonded substrate stack 50 rotates.

While keeping the shutter 2308 closed, a pump (not shown) connected tothe nozzle 2309 is actuated to feed a high-pressure jet medium (e.g.,water) to the nozzle 2309. A high-pressure jet is ejected from thenozzle 2309. When the jet stabilizes, the shutter 2308 is opened. Thejet ejected from the nozzle 2309 is continuously injected into theporous layer of the bonded substrate stack 50 to start separating thebonded substrate stack 50.

When separation of the bonded substrate stack 50 is ended, the shutter2308 is closed, and the pump connected to the nozzle 2309 is stopped tostop jet injection into the bonded substrate stack 50. Rotation of thebonded substrate stack 50 is stopped by stopping driving the rotationsource 2303.

The robot hand 400 is inserted between the table 2301 and the lowersubstrate and chucks the substrate. Simultaneously, the upper substrateis chucked by another robot to space the two substrates apart from eachother. The substrates are conveyed to predetermined positions (e.g.,cassettes).

The separating apparatus 2300 may have a substrate spacing mechanismformed from the substrate holding portion 2014 and driving mechanism2013 shown in FIG. 25 such that the two separated substrates areseparated by the spacing mechanism.

After the bonded substrate stack 50 is separated into two substrates,the jet medium is present between the two substrates. When the jetmedium is a liquid (e.g., water), the surface tension is considerablylarge. Hence, to space the two substrates apart from each other with asmall force, a jet is preferably supplied from the nozzle 2309 to thegap between the two substrates. In this case, the jet from the nozzle2309 is stopped after the two substrates are spaced apart from eachother. Instead, a mechanism for ejecting a jet used to space the twosubstrates apart from each other may be independently prepared.

Twenty-first Embodiment

FIG. 40 is a view showing the schematic arrangement of a separatingapparatus according to the 21st embodiment of the present invention. Thesame reference numerals as in other drawings substantially denote thesame constituent elements in FIG. 40.

A separating apparatus 5000 has a pair of substrate holding portions 270and 280. The substrate holding portions 270 and 280 horizontally holdand rotate a bonded substrate stack 50 by sandwiching it from the upperand lower sides. A jet is ejected from a nozzle 260 and injected to aportion near the porous layer of the bonded substrate stack 50, therebyseparating the bonded substrate stack 50 into two substrates at theporous layer.

The upper substrate holding portion 270 is coupled to one end of arotating shaft 140. The other end of the rotating shaft 140 is coupledto the rotating shaft of a motor 110 via a coupling 130. The motor 110and rotating shaft 140 may be coupled not via the coupling 130 but via,e.g., a belt or another mechanism. The motor 110 is fixed to a supportmember 120 fixed on an upper table 170. The motor is controlled by acontrol section.

A vacuum line 141 for vacuum-chucking the bonded substrate stack 50 onthe substrate holding portion 270 extends through the rotating shaft140. The vacuum line 141 is connected to an external vacuum line via aring 150. The external vacuum line has a solenoid valve (not shown). Thesolenoid valve is ON/OFF-controlled by the control section as needed.The substrate holding portion 270 has a suction hole 271 forvacuum-chucking the bonded substrate stack 50. The suction hole 271 isconnected to the vacuum line 141. The suction hole 271, vacuum line 141,and solenoid valve construct the vacuum chuck mechanism of.the substrateholding portion 270. The rotating shaft 140 is supported by the uppertable 170 via a bearing 160.

The lower substrate holding portion 280 is coupled to a rotating shaft180. The rotating shaft 180 is supported by a lower table 240 via areciprocal/rotational guide 230. The lower table 240 has, at its upperportion, a sealing member 231 for preventing the jet medium fromentering the reciprocal/rotational guide 230.

The rotating shaft 180 is coupled to the piston rod of an air cylinder320 via a coupling 330 having a radial bearing 340 for rotatably axiallysupporting the rotating shaft 180. The rotating shaft 180 has a flange182 for regulating the positional relationship between the rotatingshaft 180 and the coupling 330. Hence, when the coupling 330 is drivenupward or downward by the air cylinder 320, the rotating shaft 180 movesupward or downward accordingly. In addition, when separation of thebonded substrate stack 50 progresses, and the already separated portionswarp in the axial direction of the bonded substrate stack 50 to move thelower substrate holding portion 280 and rotating shaft 180 downward, thecoupling 330 moves downward accordingly.

The separating apparatus 5000 has an abrupt operation preventionmechanism 4000 which prevents the lower substrate holding portion 280and rotating shaft 180 from abruptly moving downward (i.e., in thedirection in which they are separated from the upper substrate holdingportion 270) during separation of the bonded substrate stack 50, andalso allows the lower substrate holding portion 280 and rotating shaft180 to moderately move. The abrupt operation prevention mechanism 4000is supported by a support member 351 fixed on the lower table 240.

The abrupt operation prevention mechanism 4000 is formed from, e.g., adamper mechanism. FIG. 41 is a view showing the arrangement of theabrupt operation prevention mechanism 4000 using a damper mechanism. Theabrupt operation prevention mechanism 4000 of this example has a framemember (e.g., a cylinder) 4440, movable portion 4480, restoring portion4470, channel 4450, and valve 4460.

The movable portion 4480 has a piston (partition plate) 4430 which formsa pressure chamber 4490 between the piston and the inner wall of theframe member 4440, a piston rod 4420, and a contact member 4410. Thesemembers have an integrated structure. The pressure chamber 4490communicates with one end of the valve 4460 via the channel 4450. Beforethe start of separation processing of the bonded substrate stack 50, thepressure chamber 4490 is filled with a fluid (e.g., a gas such as air ora liquid such as oil). The piston 4430 has an area sufficiently largerthan the sectional area of the channel 4450.

The other end of the valve 4460 is connected to a vessel storing, e.g.,a fluid. The volume of this vessel is preferably sufficiently largerthan that of the pressure chamber 4490. When air at the atmosphericpressure is used as the fluid, the other end of the valve 4460 may beopen to the air. The valve 4460 preferably has a function of adjustingthe opening degree (flow rate).

In separation processing of the bonded substrate stack 50, alreadyseparated portions of the bonded substrate stack 50 warp in the axialdirection of the bonded substrate stack 50 due to the pressure of thejet medium continuously injected into the gap formed by separation. Thelower substrate holding portion 280 and rotating shaft 180 receive aforce in the direction in which they are spaced apart from the uppersubstrate holding portion 270, i.e., downward. Hence, the movableportion 4480 of the abrupt operation prevention mechanism 4000 alsoreceives the downward force from the rotating shaft 180.

At this time, the abrupt operation prevention mechanism 4000 generates areaction against the force applied from the rotating shaft 180. Themagnitude of this reaction depends on the acceleration of the lowersubstrate holding portion 280 and rotating shaft 180, i.e., theacceleration of the movable portion 4480.

More specifically, the abrupt operation prevention mechanism 4000 hasthe channel 4450 for discharging the fluid from the pressure chamber4490 and the valve 4460i for adjusting the fluid discharge amount. Asthe movable portion 4480 moves downward, the fluid in the pressurechamber 4490 is discharged. When the movable portion 4480 moderatelymoves downward, the fluid in the pressure chamber 4490 is discharged inaccordance with the movement, and the pressure in the pressure chamber4490 less increases. Hence, the reaction applied from the movableportion 4480 to the rotating shaft 180 is small. On the other hand, whenthe movable portion 4480 abruptly moves downward, discharge of the fluidin the pressure chamber 4490 cannot follow the movement, and thepressure in the pressure chamber 4490 abruptly increases. Hence, thereaction applied from the movable portion 4480 to the rotating shaft islarge.

The abrupt operation prevention mechanism 4000 prevents the lowersubstrate holding portion 280 from abruptly moving downward but allowsit to moderately move downward. In other words, the abrupt operationprevention mechanism 4000 prevents the bonded substrate stack 50 fromabruptly warping in the axial direction but allows it to moderatelywarp.

When separation of one bonded substrate stack 50 is ended, andseparation processing of the next bonded substrate stack 50 is to beexecuted, the lower substrate holding portion 280 and rotating shaft 180are driven upward by the air cylinder 320 to hold the new bondedsubstrate stack 50. At t his time, the restoring portion 4470 pressesthe movable portion 4480 upward to bring the contact member 4410 of themovable portion 4480 into contact with the rotating shaft 180.

The restoring portion 4470 extends the piston 4430 to fill the pressurechamber 4490 with the fluid or fills the pressure chamber 4490 with thefluid to extend the piston 4430. In the arrangement shown in FIG. 41,the restoring portion 4470 comprises a spring. The piston 4430 isextended by the restoring force of the spring. With this operation, thepressure chamber 4490 is filled with the fluid via the channel 4450 andvalve 4460.

Conversely, another arrangement may be employed, in which the pressurechamber 4490 is filled with the fluid via the channel 4450 and valve4460, as shown in FIG. 42, or the pressure chamber 4490 is filled withthe fluid via another channel, as shown in FIG. 43, to extend the piston4430.

FIG. 42 is a view showing a modification of the abrupt operationprevention mechanism 4000 shown in FIG. 41. FIG. 42 shows an abruptoperation prevention mechanism in which the pressure chamber 4490 isfilled with the fluid via the channel 4450 used to discharge the fluidfrom, the pressure chamber 4490. In the abrupt operation preventionmechanism 4000 with this arrangement, when separation processing is tobe executed, a valve 4530 is opened, and a valve 4510 is closed todischarge the fluid in the pressure chamber 4490 via the channel 4450,valve 4460, channel 4500, and valve 4530. To extend the movable portion4480, the valve 4530 is closed, and the valve 4510 is opened to fill thepressure chamber 4490 with the fluid by a pressure source 4520.

FIG. 43 is a view showing another modification of the abrupt operationprevention mechanism 4000 shown in FIG. 41. FIG. 43 shows an abruptoperation prevention mechanism having a channel 4600 for filling thepressure chamber 4490 with the fluid in addition to the channel 4450used to discharge the fluid from the pressure chamber 4490. In theabrupt operation prevention mechanism 4000 with this arrangement, whenseparation processing is to be executed, the valve 4460 is adjusted to adesired opening degree, and a valve 4610 is closed to discharge thefluid in the pressure chamber 4490 via the channel 4450 and valve 4460.To extend the movable portion 4480, the valve 4460 is closed, and thevalve 4610 is opened to fill the pressure chamber 4490 with the fluid bya pressure source 4620.

This abrupt operation prevention mechanism 4000 prevents the bondedsubstrate stack 50 from abruptly warping in the axial direction butallows it to moderately warp, as described above. The abrupt operationprevention mechanism 4000 effectively prevents any defects on the firstsubstrate side or second substrate side in separation processing of thebonded substrate stack 50 and, more particularly, at the final stage ofseparation processing. The reason for this will be described below.

Already separated portions of the bonded substrate stack 50 warp in theaxial direction of the bonded substrate stack 50 due to the pressure ofthe jet medium injected between the already separated portions. Inaccordance with the degree of this warp, the lower substrate holdingportion 280 moves in the direction in which it is separated from theupper substrate holding portion 270, i.e., downward. As separationprogresses and reaches the central portion of the bonded substrate stack50, the warp amount becomes large, and the moving amount of the lowersubstrate holding portion 280 increases accordingly.

When separation further progresses and reaches the final stage, thebonding force of the unseparated portions of the bonded substrate stack50 (force for bonding the first substrate side and the second substrateside) abruptly becomes smaller than the separation force of the bondedsubstrate stack by the jet medium (force acting to peel the bondedsubstrate stack into two substrates).

In a separating apparatus without any abrupt operation preventionmechanism 4000, the bonding force cannot stand the separation force, andthe lower substrate holding portion 280 instantaneously abruptly moves.At this time, the unseparated regions of the bonded substrate stack 50are peeled at once, and this may generate a defect on the first orsecond substrate side.

The separating apparatus 5000 according to the 21st embodiment has theabrupt operation prevention mechanism 4000 that prevents theabove-described abrupt operation of the substrate holding portion 280.As a consequence, any defect on the first or second substrate side canbe prevented. The abrupt operation prevention mechanism 4000 allows thesubstrate holding portion 280 to moderately move in separation. Hence,already separated portions of the bonded substrate stack 50 warp in theaxial direction of the bonded substrate stack 50 in separation, and thebonded substrate stack 50 can be efficiently separated.

The abrupt operation prevention mechanism 4000 preferably has astructure capable of preventing knocking when the movable portion 4480moves, i.e., a structure having less frictional resistance. Whenknocking occurs, the lower substrate holding portion 280 moves stepwise.For this reason, separation of the bonded substrate stack 50 progressesstepwise, and this may generate a defect on the first or secondsubstrate side.

The abrupt operation prevention mechanism 4000 is preferably coaxialwith the rotating shaft 180. With this arrangement, the substrateholding portion 280 and substrate holding portion 280 can be smoothlyrotated.

A vacuum line 181 for vacuum-chucking the bonded substrate stack 50 onthe substrate holding portion 280 extends through the rotating shaft180. The vacuum line 181 is connected to an external vacuum line via aring 190. The external vacuum line has a solenoid valve (not shown) Thesolenoid valve is ON/OFF-controlled by the control section (not shown)as needed.

The substrate holding portion 280 has a suction hole 281 forvacuum-chucking the bonded substrate stack 50. The suction hole 281 isconnected to the vacuum line 181. The suction hole 281, vacuum line 181,and solenoid valve construct the vacuum chuck mechanism of the substrateholding portion 280.

The lower table 240 is supported by a plurality of leg members 310. Theupper table 170 is supported on the lower table 240.

The nozzle 260 is attached to, e.g., the lower table 240 via a supportmember (not shown). In the separating apparatus 5000 of the 21stembodiment, the position of the nozzle 260 is controlled with referenceto the position of the upper substrate holding portion 270. A shutter251 driven by a motor 250 is inserted between the nozzle 260 and thesubstrate holding portions 270 and 280. When the shutter 251 is open,and a jet is ejected from the nozzle 260, the jet can be injected intothe bonded substrate stack 50. When the shutter 251 is closed, jetinjection into the bonded substrate stack 50 can be stopped.

In the separating apparatus 5000, since the upper substrate holdingportion 270 does not move in the vertical direction, an abrupt operationprevention mechanism for preventing the abrupt operation of the uppersubstrate holding portion 270 is unnecessary. However, when a substrateholding portion moving in the vertical direction is employed as theupper substrate holding portion 270, an abrupt operation preventionmechanism for preventing the abrupt operation of the upper substrateholding portion 270 is preferably prepared.

Procedures of separation processing of a bonded substrate stack by theseparating apparatus 5000 will be described below. First, the aircylinder 320 retracts the piston rod to form an appropriate gap betweensubstrate holding portions 270 and 280. In this state, the bondedsubstrate stack 50 is horizontally supported by the robot hand 400 fromthe lower side and inserted to a predetermined position between thesubstrate holding portions 270 and 280.

The air cylinder 320 extends the piston rod to move the lower substrateholding portion 280 upward. The substrate holding portion 280 pressesand holds the bonded substrate stack 50.

The movable portion 4480 of the abrupt operation prevention mechanism4000 is moved upward to abut the contact member 4410 of the movableportion 4480 against the lower end of the rotating shaft 180.

The motor 110 is actuated to transmit the rotational force to therotating shaft 140. The rotating shaft 140, substrate holding portion270, bonded substrate stack. 50, substrate holding portion 280, androtating shaft 180 rotate integrally.

While keeping the shutter 251 closed, a pump (not shown) connected tothe nozzle 260 is actuated to feed a high-pressure jet medium (e.g.,water) to the nozzle 260. A high-pressure jet is ejected from the nozzle260. When the jet stabilizes, the shutter 251 is opened. The jet ejectedfrom the nozzle 260 is continuously injected into the porous layer ofthe bonded substrate stack 50 to start separating the bonded substratestack 50.

Separation of the bonded substrate stack 50 progresses spirally from theouter peripheral portion to the central portion. More specifically,separation of the bonded substrate stack 50 progresses such that theboundary between the already separated region (separated region) and theregion that has not been separated (unseparated region) draws a spirallocus.

The separated region warps due to the pressure of the injected jetmedium. When separation progresses, and the warp becomes large to somedegree, the substrate holding portion 280 is pressed by the bondedsubstrate stack and starts moving downward. Movement of the substrateholding portion 280 is controlled by the abrupt operation preventionmechanism 4000, as described above. More specifically, the substrateholding portion 280 moderately moves but does not move abruptly. Hence,the above-described defect due to abrupt movement of the substrateholding portion 280 can be effectively prevented.

The characteristics of the abrupt operation prevention mechanism 4000may be changed in accordance with the progress of separation bycontrolling the opening degree of the valve 4460 in accordance with theprogress of separation. The opening degree of the valve 4460 may beadjusted in accordance with the characteristics (e.g., the diameter orthickness) of the bonded substrate stack 50 to be processed orseparation processing condition (e.g., jet pressure or jet diameter).

When separation of the bonded substrate stack 50 is ended, the shutter251 is closed, and the pump connected to the nozzle 260 is stopped tostop jet injection into the bonded substrate stack 50. The operation ofthe motor 110 is also stopped.

The vacuum chuck mechanisms of the substrate holding portions 270 and280 are actuated (solenoid valves are open) to cause the substrateholding portion 270 to vacuum-chuck the upper separated substrate andthe substrate holding portion 280 to vacuum-chuck the lower separatedsubstrate.

The air cylinder 320 retracts the piston rod to form a predetermined gapbetween the substrate holding portions 270 and 280. The two separatedsubstrates are spaced apart from each other.

The robot hand 400 is inserted between the substrate and the substrateholding portion 270. The robot hand 400 chucks the substrate. Afterthat, chuck by the vacuum chuck mechanism of the substrate holdingportion 270 is canceled. The substrate is transferred from the substrateholding portion 270 to the robot hand 400. The robot hand 400 conveysthe substrate to a predetermined position (e.g., a cassette).

The robot hand 400 is inserted between the substrate and the substrateholding portion 280. The robot hand 400 chucks the substrate. Afterthat, chuck by the vacuum chuck mechanism of the substrate holdingportion 280 is canceled. The substrate is transferred from the substrateholding portion 280 to the robot hand 400. The robot hand 400 conveysthe substrate to a predetermined position (e.g., a cassette). The twoseparated substrates may be received by the robot hand in the reverseorder or simultaneously received by two robot hands (not shown).

After the bonded substrate stack 50 is separated into two substrates,the jet medium is present between the two substrates. When the jetmedium is a liquid (e.g., water), the surface tension is considerablylarge. Hence, to space the two substrates apart from each other with asmall force, a jet is preferably supplied from the nozzle 260 to the gapbetween the two substrates. In this case, the jet from the nozzle 260 isstopped after the two substrates are spaced apart from each other.Instead, a mechanism for ejecting a jet used to space the two substratesapart from each other may be independently prepared.

Twenty-second Embodiment

FIGS. 31 and 32 are views showing the schematic arrangement of aseparating apparatus according to the 22nd embodiment of the presentinvention. A separating apparatus 2400 combines a separating apparatusrepresented by one of the above-described embodiments with a cleaningapparatus.

As a representative separating apparatus, a separating apparatus will beexemplified in which a pair of substrate holding portions 2401 and 2402horizontally hold and rotate a bonded substrate stack 50, and a jet isejected from a nozzle 2405 toward the porous layer of the bondedsubstrate stack 50, thereby separating the bonded substrate stack 50into two substrates at the porous layer. In this separating apparatus,the substrate holding portions 2401 and 2402 are coupled to rotatingshafts 2403 and 2404, respectively. A rotational force is transmitted tothe substrate holding portions via at least one of the rotating shafts.

A shutter 2406 is inserted between the nozzle 2405 and the substrateholding portions 2401 and 2402. The shutter 2406 need not always beprepared. Jet injection into the bonded substrate stack 50 can becontrolled not by using the shutter 2406 but by, e.g., moving the nozzle2405 or controlling a pump connected to the nozzle 2405 (this alsoapplies to the remaining embodiments).

The cleaning apparatus ejects a cleaning solution supplied from a supplyline 2408 of the cleaning solution (e.g., water) from a cleaning nozzle2407 to the bonded substrate stack 50.

An example of processing procedures by this separating apparatus will bedescribed below. First, the pair of substrate holding portions 2401 and2402 horizontally hold and rotate the bonded substrate stack 50. Asshown in FIG. 31, a jet is ejected from the nozzle 2405, and the shutter2406 is open. The jet is injected into the porous layer of the bondedsubstrate stack 50 to start separating the bonded substrate stack 50.

The bonded substrate stack 50 may be separated while the cleaningsolution is ejected from the cleaning nozzle 2407 to clean the bondedsubstrate stack 50.

When separation of the bonded substrate stack 50 is ended, the shutter2406 is closed. After that, jet ejection from the nozzle 2405 is stopped(operation of the pump is stopped).

As shown in FIG. 32, in the state wherein the substrate holding portions2401 and 2402 are rotated or stopped, the separated substrates arechucked by the substrate holding portions 2401 and 2402 and spaced apartfrom each other.

The cleaning solution is ejected from the cleaning nozzle 2407 to cleanthe two separated substrates.

According to this separating apparatus, separation processing of thebonded substrate stack 50 and cleaning of the separated substrates canbe efficiently performed.

Twenty-third Embodiment)

FIGS. 33 and 34 are views showing the schematic arrangement of aseparating apparatus according to the 23rd embodiment of the presentinvention. In a separating apparatus 2500, a pair of holding portions2501 and 2502 horizontally hold a bonded substrate stack 50. After thebonded substrate stack 50 is separated into two substrates by a jetejected from a nozzle 2505, one or both of the substrate holdingportions 2501 and 2502 are moved in the horizontal direction to spacethe separated substrates apart from each other.

The substrate holding portions 2501 and 2502 are coupled to rotatingshafts 2503 and 2504, respectively. A rotational force is transmitted tothe substrate holding portions via at least one of the rotating shafts.The substrate holding portions 2501 and 2502 have suction holes 2501 aand 2502 a for vacuum-chucking the bonded substrate stack 50,respectively. The suction holes 2501 a and 2502 a are connected tovacuum lines 2503 a and 2504 a in the rotating shafts 2503 and 2504,respectively. A shutter 2506 is inserted between the nozzle 2505 and thesubstrate holding portions 2501 and 2502.

Procedures of separation processing by the separating apparatus 2500will be described below. First, as shown in FIG. 33, the pair ofsubstrate holding portions 2501 and 2502 horizontally hold the bondedsubstrate stack 50. At least one of the rotating shafts 2503 and 2504 isrotated to rotate the bonded substrate stack 50. Next, as shown in FIG.33, a jet is ejected from the nozzle 2505, and the shutter 2506 isopened. The jet is injected into the porous layer of the bondedsubstrate stack 50 to start separating the bonded substrate stack.50.

When separation of the bonded substrate stack 50 is ended, the shutter2506 is closed. After that, jet ejection from the nozzle 2505 is stopped(operation of the pump is stopped).

As shown in FIG. 34, in the state wherein the substrate holding portions2501 and 2502 are rotated or stopped, one or both of the pair ofsubstrate holding portions 2501 and 2502 are moved in the horizontaldirection to space the separated substrates apart from each other. Whenone or both of the pair of substrate holding portions 2501 and 2502 aremoved in the horizontal direction along the separated surface of thebonded substrate stack 50, the two substrates can be easily spaced apartfrom each other independently of the influence of the surface tensionacting between the two substrates.

Twenty-fourth Embodiment

This embodiment provides various separating methods with an emphasis onthe relationship between a bonded substrate stack and a nozzle forejecting a jet in separation processing. Although the followingseparating methods are suitable for separating a horizontally heldbonded substrate stack, they can be applied to separate a bondedsubstrate stack held at another angle (e.g., vertically).

In the first separating method, a jet is injected into the porous layerof a bonded substrate stack in parallel to the porous layer, andsimultaneously, the bonded substrate stack is rotated aboutsubstantially the center of the bonded substrate stack, as described inthe above embodiments.

In the second separating method, as shown in FIG. 35 (plan view), a jetis injected into the porous layer of a bonded substrate stack 50 inparallel to the porous layer, and simultaneously, a nozzle 51 is scannedalong the porous layer by a driving mechanism 2601.

In the third separating method, as shown in FIG. 36 (plan view), a jetis injected into the porous layer of a bonded substrate stack 50 inparallel to the porous layer, and simultaneously, a table 2602 on whicha holding portion 52 of the bonded substrate stack 50 is mounted ismoved by a driving mechanism 2603 to scan the bonded substrate stack 50.

In the fourth separating method, as shown in FIGS. 37A and 37B (planviews), a jet is injected into the porous layer of a bonded substratestack 50 in parallel to the porous layer, and simultaneously, a rotatingshaft 2604 is pivoted to pivot the nozzle 51 fixed to the rotating shaft2604 and scan the jet such that the jet draws a sector-shaped locus.

In the fifth separating method, as shown in FIG. 38 (plan view), a jetis injected into the porous layer of a bonded substrate stack 50 inparallel to the porous layer, and simultaneously, the nozzle 51 isscanned along the porous layer by the driving mechanism 2601 while theholding portion 52 is rotated to rotate the bonded substrate stack 50.

All the above separating methods can be applied to the separatingapparatuses of the above embodiments. However, another separating methodmay be applied.

Twenty-fifth Embodiment

FIG. 39 is a plan view showing the schematic arrangement of a separatingsystem according to the 25th embodiment of the present invention. Aseparating system 3000 of this embodiment has, as a separating apparatus3020, a separating apparatus represented by one of the aboveembodiments.

A separating system 3000 has a scalar robot 3150 at a predeterminedposition (e.g., at the center) on a support table 3200. Variousprocessing apparatuses are disposed around the scalar robot 3150 atsubstantially equidistant positions separated from the scalar robot3150. More specifically, in this embodiment, a loader 3080, centeringapparatus 3070, separating apparatus 3020, turning apparatus 3130,cleaning/drying apparatus 3120, third unloader 3110, second unloader3100, and first unloader 3090 are disposed at substantially equidistantpositions separated from the scalar robot 3150.

Before processing, a first cassette 3081 storing one or a plurality ofbonded substrate stacks is placed on the loader 3080. Before processing,empty cassettes 3091, 3101, and 3111 are placed on the first unloader3090, second unloader 3100, and third unloader 3110, respectively.

The centering apparatus 3070 receives a bonded substrate stack from thescalar robot 3150, executes processing (centering) for aligning thecenter of the bonded substrate stack at a predetermined position, andthen transfers the bonded substrate stack to the scalar robot 3150.

The separating apparatus 3020 is disposed in a chamber 3010 to preventthe jet medium (e.g., water) to be described later from scattering tothe peripheral portion. The chamber 3010 has a shutter 3060 throughwhich the robot hand of the scalar robot 3150 enters/leaves the chamber.The separating apparatus 3020 has a nozzle 3040 for ejecting a jet. Theposition of the nozzle 3040 is controlled by an orthogonal robot 3050.

The turning apparatus 3130 rotates the upper substrate of two separatedsubstrates through 180° to turn the substrate (direct the separatedsurface upward). The cleaning/drying apparatus 3120 cleans and driesseparated substrates.

The separating system 3000 executes separation processing of a bondedsubstrate stack on the basis of an instruction from an operation panel3140.

Procedures of separation processing by this processing system 3000 willbe described below. First, the cassette 3081 storing bonded substratestacks to be processed is placed at a predetermined position on theloader 3080 manually or automatically. The empty cassettes 3091, 3101,and 3111 are placed on the first unloader 3090, second unloader 3100,and third unloader 3110, respectively. In this embodiment, the cassette3091 is used to store upper separated substrates, the cassette 3101 isused to store lower separated substrates, and the cassette 3111 is usedto store bonded substrate stacks (or separated substrates) for whichseparation has failed. The cassette 3081 is placed on the loader 3080such that the stored bonded substrate stacks become horizontal. Thecassette 3091, 3101, and 3111 are placed on the first unloader 3090,second unloader 3100, and third unloader 3120, respectively, such thatsubstrates can be stored in a horizontal state.

The scalar robot 3150 chucks the lowermost bonded substrate stack in thecassette 3081, extracts the bonded substrate stack, and transfers it tothe centering apparatus 3070 while maintaining the horizontal state. Thecentering apparatus 3070 centers the bonded substrate stack andtransfers it to the scalar robot 3150.

The shutter 3060 of the chamber 3010 is opened to transfer the centeredbonded substrate stack from the scalar robot 3150 to the separatingapparatus 3020 while maintaining the horizontal state. The bondedsubstrate stack has already been centered. For this reason, when therobot hand of the scalar robot 3150 is moved to a predetermined positionto transfer the bonded substrate stack to the separating apparatus 3020,the bonded substrate stack can be positioned to the separatingapparatus.

The shutter 3060 of the chamber 3010 is closed, and separationprocessing is executed by the separating apparatus 3020. Morespecifically, the separating apparatus 3020 ejects a jet from the nozzle3040 to the porous layer of the bonded substrate stack while rotatingthe bonded substrate stack held in the horizontal state, and separatesthe bonded substrate stack into two substrates at the porous layer bythe jet.

The shutter 3060 of the chamber 3010 is opened, and the scalar robot3150 receives the upper separated substrate from the separatingapparatus 3020 and transfers the substrate to the turning apparatus3130. The scalar robot 3150 preferably receives the upper separatedsubstrate and transfers it to the turning apparatus 3130 while chuckingthe upper portion of the substrate. With this arrangement, chipssticking to the separated surface rarely stick to the robot hand of thescalar robot 3150. The turning apparatus 3130 rotates the receivedsubstrate through 180°, i.e., turns the substrate and transfers it tothe scalar robot 3150. In place of the turning apparatus 3130, amechanism for rotating the robot hand of the scalar robot 3150 through1800 may be prepared, and the substrate may be turned by rotating therobot hand through 1800.

The scalar robot 3150 transfers the turned substrate to thecleaning/drying apparatus 3120. The scalar robot 3150 preferablyreceives the substrate from the turning apparatus 3130 and transfers thesubstrate to the cleaning/drying apparatus 3120 while supporting thesubstrate from the lower surface in the horizontal state. This preventsthe substrate from dropping. The cleaning/drying apparatus 3120 cleansand dries the received substrate and transfers it to the scalar robot3150 in the horizontal state.

The scalar robot 3150 stores the cleaned and dried substrate in thecassette 3091 on the first unloader 3090. The scalar robot 3150preferably receives the substrate from the cleaning/drying apparatus3120 and stores it in the cassette 3091 while supporting the substratefrom the lower side in the horizontal state. This prevents the substratefrom dropping.

The scalar robot 3150 receives the lower separated substrate from theseparating apparatus 3020 and transfers the substrate to thecleaning/drying apparatus 3120. The scalar robot 3150 preferablyreceives the substrate and transfers it to the cleaning/drying apparatus3120 while supporting the substrate from the lower side in thehorizontal state. This prevents the substrate from dropping. Thecleaning/drying apparatus 3120 cleans and dries the received substrateand transfers it to the scalar robot 3150 in the horizontal state.

The scalar robot 3150 stores the cleaned and dried substrate in thecassette 3111 on the second unloader 3100. The scalar robot 3150preferably receives the substrate from the cleaning/drying apparatus3120 and stores the substrate in the cassette 3111 while supporting thesubstrate from the lower side in the horizontal state. This prevents thesubstrate from dropping.

Operation of the separating system 3000 for one bonded substrate stackhas been described above. In the separating system 3000, a plurality ofbonded substrate stacks can be parallelly processed. For example, whilethe first bonded substrate stack is transferred from the centeringapparatus 3070 to the separating apparatus 3020 and is being separatedby the separating apparatus 3020, the second bonded substrate stack isextracted from the cassette 3081 on the loader 3080, transferred to thecentering apparatus 3070, and centered. That is, in the separatingsystem 3000, centering processing by the centering apparatus 3070,separation processing by the separating apparatus 3020, turningprocessing by the turning apparatus 3130, and cleaning/drying processingby the cleaning/drying apparatus 3120 can be parallelly executed.

In the separating system 3000, the scalar robot 3150 stores a substratefor which separation has failed in the cassette 3111 on the thirdunloader 3110 in accordance with an instruction input from the operatorvia the operation panel 3140. Instead of recognizing a separationfailure in accordance with an instruction from the operator, aseparation state monitor apparatus may be prepared to detect aseparation failure.

According to this embodiment, since the bonded substrate stack orseparated substrate is conveyed in the horizontal state, the scalarrobot 3150 having a relatively simple structure can be employed as theconveyor mechanism.

In addition, according to this embodiment, since the apparatuses aredisposed at substantially equidistant positions separated from thescalar robot 3150, the bonded substrate stack or separated substrate canbe efficiently conveyed among the apparatuses.

According to the present invention, since the sample is horizontallyheld, drop of, e.g., a plate-like sample can be prevented, andseparation processing can executed at a high yield.

The present invention is not limited to the above embodiments andvarious changes and modifications can be made within the spirit andscope of the present invention. Therefore, to apprise the public of thescope of the present invention, the following claims are made.

What is claimed is:
 1. A separating apparatus for separating a plateshaped sample having a separation layer at the separation layer,comprising: a holding mechanism for holding the plate shaped sample in asubstantially horizontal state while rotating the sample, said holdingmechanism comprising a convex support portion at a substantially centralportion thereof and a plurality of guide members at outer peripheralportions thereof; and an ejection portion for ejecting a fluid to theseparation layer of the plate shaped sample held by said holdingmechanism to separate the plate shaped sample at the separation layer bythe fluid.
 2. The apparatus according to claim 1, wherein said holdingmechanism comprises a pair of sample holding mechanisms for holding theplate shaped sample by sandwiching the sample from upper and lowersides.
 3. The apparatus according to claim 2, wherein said pair ofholding mechanisms have chuck mechanisms for chucking the plate shapedsample, respectively.
 4. The apparatus according to claim 2, whereinsaid pair of holding mechanisms have an application portion for applyinga press force to the plate shaped sample in an axial direction, and holdthe plate shaped sample to which the press force is being applied bysaid application portion.
 5. The apparatus according to claim 2, whereinsaid pair of holding, mechanisms have an application portion forapplying a force to the plate shaped sample in an axial direction, andhold the plate shaped sample to which the force is being applied by saidapplication portion.
 6. The apparatus according to claim 4, wherein saidapplication portion presses the plate shaped sample in the axialdirection using a force of a spring.
 7. The apparatus according to claim4, wherein said application portion presses the plate shaped sample inthe axial direction using a force generated by a cylinder.
 8. Theapparatus according to claim 4, wherein said application portion pressesthe plate shaped sample in the axial direction using pressure of afluid.
 9. The apparatus according to claim 2, wherein at least one ofsaid pair of sample holding mechanisms comprises a Bernoulli chuck. 10.The apparatus according to claim 4, wherein said application portionsupplies a fluid to a surface of the plate shaped sample and applies thepress force to the plate shaped sample using the fluid.
 11. Theapparatus according to claim 10, wherein the fluid supplied to thesurface of the plate shaped sample by said application portion is aliquid.
 12. The apparatus according to claim 10, wherein the fluidsupplied to the plate shaped sample by said application portion is agas.
 13. The apparatus according to claim 4, wherein at least one ofsaid pair of sample holding mechanisms comprises a holding member thatcomes into contact with the plate shaped sample to hold the plate shapedsample, and said application portion applies the press force to theplate shaped sample via said holding member.
 14. The apparatus accordingto claim 13, wherein said application portion presses said holdingmember using a fluid and applies the press force to the plate shapedsample via said holding member.
 15. The apparatus according to claim 14,wherein the fluid supplied to said holding member by said applicationportion is a liquid.
 16. The apparatus according to claim 14, whereinthe fluid supplied to said holding member by said application portion isa gas.
 17. The apparatus according to claim 2, wherein at least one ofsaid pair of sample holding mechanisms comprises a holding member thatcomes into contact with the plate shaped sample to hold the plate shapedsample and a Bernoulli chuck for supporting said holding member.
 18. Theapparatus according to claim 13, wherein said application portionpresses said holding member using a magnetic force and applies the pressforce to the plate shaped sample via said holding member.
 19. Theapparatus according to claim 4, wherein said application portion appliesthe press force to the plate shaped sample from a lower sample holdingmechanism of said pair of sample holding mechanisms while fixing avertical position of an upper sample holding mechanism.
 20. Theapparatus according to claim 4, wherein said application portion appliesthe press force to the plate shaped sample from an upper sample holdingmechanism of said pair of sample holding mechanisms while fixing avertical position of a lower sample holding mechanism.
 21. The apparatusaccording to claim 4, wherein said application portion applies the pressforce to the plate shaped sample from both of said pair of sampleholding mechanisms.
 22. The apparatus according to claim 4, wherein saidapplication portion applies the press force to the plate shaped sampleusing a weight.
 23. The apparatus according to claim 22, wherein saidapplication portion changes stepwise the force for pressing the plateshaped sample using a plurality of weights.
 24. The apparatus accordingto claim 22, wherein said application portion presses the plate shapedsample with a relatively small force when a portion near a periphery ofthe plate shaped sample is to be separated, and presses the plate shapedsample with a relatively large force when a portion near the center ofthe plate shaped sample is to be separated.
 25. The apparatus accordingto claim 22, wherein said application portion presses the plate shapedsample with a relatively small force at a first step of separation, ofthe plate shaped sample, and presses the plate shaped sample with arelatively large force at a second step of separation of the plateshaped sample.
 26. The apparatus according to claim 22, wherein saidapplication portion presses the portion near the center of the plateshaped sample.
 27. The apparatus according to claim 4, wherein saidapplication portion presses the plate shaped sample with a relativelysmall force when a portion near a periphery of the plate shaped sampleis to be separated, and presses the plate shaped sample with arelatively large force when a portion near the center of the plateshaped sample is to be separated.
 28. The apparatus according to claim4, wherein said application portion presses the plate shaped sample witha relatively small force at a first step of separation of the plateshaped end sample, and presses the plate shaped sample with a relativelylarge force at a second step of separation of the plate shaped sample.29. The apparatus according to claim 4, wherein said application portionpresses the portion near the center of the plate shaped sample.
 30. Theapparatus according to claim 1, wherein said holding mechanism has astructure capable of transferring/receiving the plate shaped sampleto/from a conveyor mechanism for chucking a surface of the plate shapedsample to hold the sample.
 31. The apparatus according to claim 13,wherein said convex support portion of said holding mechanism holds theplate shaped sample while forming a gap between a predetermined portionof a surface of the plate shaped sample and a predetermined portion of asurface of said holding member.
 32. The apparatus according to claim 1,wherein said holding mechanism holds a substantially central portion ofthe plate shaped sample.
 33. The apparatus according to claim 1, whereinsaid holding mechanism comprises a sample holding mechanism for holdingone surface of the plate shaped sample.
 34. The apparatus according toclaim 33, wherein said sample holding mechanism comprises a chuckmechanism for chucking the plate shaped sample.
 35. The apparatusaccording to claim 34, wherein said chuck mechanism chucks a pluralityof portions of the plate shaped sample.
 36. The apparatus according toclaim 34, wherein said chuck mechanism chucks a peripheral portion ofthe plate shaped sample.
 37. The apparatus according to claim 34,wherein said chuck mechanism chucks the plate shaped sample to warp theplate shaped sample.
 38. The apparatus according to claim 34, whereinsaid holding mechanism has a structure capable of exchanging the plateshaped sample with a conveyor mechanism for chucking a surface of theplate shaped sample to hold the sample.
 39. The apparatus according toclaim 34, wherein said chuck mechanism chucks the plate shaped samplewhen a portion near a periphery of the plate shaped sample is to beseparated, and does not chuck the plate shaped sample when a portionnear the center of the plate shaped sample is to be separated.
 40. Theapparatus according to claim 34, wherein said chuck mechanism chucks theplate shaped sample at a first step of separation of the plate shapedsample, and does not chuck the plate shaped sample at a second step ofseparation of the plate shaped sample.
 41. The apparatus according toclaim 1, wherein said plurality of guide members of said holdingmechanism support an edge portion of the plate shaped sample.
 42. Theapparatus according to claim 1, wherein said plurality of guide membersof said holding mechanism support an edge portion of the plate shapedsample and said holding mechanism further comprises a rotation sourcefor rotating at least one of said plurality of guide members, and theplate shaped sample is rotated by transmitting a rotational force fromsaid rotated guide member to the plate shaped sample.
 43. The apparatusaccording to claim 41, wherein said holding mechanism further comprisesa table for supporting said plurality of guide members, and a rotationsource for rotating said table, and the plate shaped sample is rotatedby rotating said table.
 44. The apparatus according to claim 41, whereinsaid convex portion of said holding mechanism partially supports a lowersurface of the plate shaped sample.
 45. The apparatus according to claim42, wherein said convex portion of said holding mechanism partiallysupports a lower surface of the plate shaped sample, said convex supportportion being rotated together with the plate shaped sample placed onsaid support portion.
 46. The apparatus according to claim 41, furthercomprising a driving mechanism for driving at least one of saidplurality of guide members toward the center or outer periphery of theplate shaped sample, and when the plate shaped sample is to be held, atleast one of said plurality of guide members is driven toward the centerby said driving mechanism.
 47. The apparatus according to claim 41,wherein each of said plurality of guide members has a shape obtained bybonding bottom portions of two cones.
 48. The apparatus according toclaim 1, further comprising a spacing mechanism for, after the plateshaped sample is separated into two samples, spacing the separatedplated shaped samples apart from each other.
 49. The apparatus accordingto claim 48, wherein said spacing mechanism spaces the separated plateshaped samples apart substantially in the axial direction.
 50. Theapparatus according to claim 48, wherein said spacing mechanism spacesthe separated plate shaped samples apart substantially in a planardirection.
 51. The apparatus according to claim 1, further comprising acleaning portion for cleaning the plate shaped sample which is beingseparated or the separated plate shaped samples.
 52. A separatingapparatus for separating a plate shaped sample having a separation layerat the separation layer, comprising: a holding mechanism for pressingand holding the plate shaped sample in a substantially horizontal statewhile rotating the sample, said holding mechanism comprising a convexsupport portion at a substantially central portion thereof and aplurality of guide members at outer peripheral portions thereof; and anejection portion for ejecting a fluid to the separation layer of theplate shaped sample held by said holding mechanism to separate the plateshaped sample at the separation layer by the fluid.
 53. The apparatusaccording to claim 52, further comprising a scanning portion forscanning said ejection portion of the plate shaped sample in separatingthe plate-like sample.
 54. The apparatus according to claim 52, furthercomprising a pivot portion for pivoting said ejection portion about anaxis parallel to an axis of the plate shaped sample.
 55. The apparatusaccording to claim 1, wherein the plate shaped sample to be processedhas a fragile layer as the separation layer.
 56. The apparatus accordingto claim 55, wherein the fragile layer is a porous layer.
 57. Theapparatus according to claim 55, wherein the fragile layer is amicrocavity layer.
 58. The apparatus according to claim 1, wherein theplate shaped sample to be processed is a semiconductor substrate. 59.The apparatus according to claim 1, wherein the plate shaped sample tobe processed is formed by bonding a first substrate and a secondsubstrate and has a fragile layer as the separation layer.
 60. Theapparatus according to claim 1, wherein the plate shaped sample to beprocessed is formed by forming a porous layer on a surface of a firstsemiconductor substrate, forming an unporous layer on the porous layer,and bonding a second substrate to the unporous layer.
 61. A separatingsystem comprising: a separating apparatus of claim 1; and a conveyorrobot for transferring a plate shaped sample to said separatingapparatus in a substantially horizontal state and receiving in thesubstantially horizontal state plate shaped samples separated by saidseparating apparatus.
 62. The system according to claim 61, wherein saidconveyor robot transfers the plate shaped sample while supporting thesample from a lower side to said separating apparatus.
 63. The systemaccording to claim 61, wherein said conveyor robot receives a lowerplate shaped sample of two separated plate shaped samples from saidseparating apparatus while supporting the sample from the lower side.64. The system according to claim 61, wherein said conveyor robotreceives an upper plate shaped sample of the two separated plate shapedsamples from said separating apparatus while supporting the sample froman upper side.
 65. The system according to claim 61, wherein said systemfurther comprises a centering apparatus for aligning the center of theplate shaped sample at a predetermined position, and said conveyor robotreceives the plate shaped sample from said centering apparatus andtransfers the sample to said separating apparatus.
 66. The systemaccording to claim 61, wherein said system further comprises a turningapparatus for rotating the plate shaped sample through 180° to turn thesample, and said conveyor robot transfers the upper plate shaped sample,separated by said separating apparatus, to said turning apparatus in thehorizontal state.
 67. The system according to claim 61, furthercomprising a cleaning/drying apparatus for cleaning and drying the plateshaped samples separated by said separating apparatus.